Backlight Signal Line Layout Around Support Structures
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Solution Overview
Problem
The displacement of support pillars on glass substrates in backlight modules can cause hot melt adhesive to displace and peel off signal traces, leading to potential signal trace failure and increased line resistance.
Innovation Solution
The design of signal lines with alternating straight and detour sub-portions that avoid overlapping with support structures, ensuring minimal overlap with support structures, thereby preventing adhesive displacement and maintaining signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If support pillars are glued to glass substrate with hot melt adhesive, then support structures can be fixed without forming holes, but the hot melt adhesive may displace and cause signal traces to peel off
Solution Approach 1:
The signal line is segmented into multiple portions: a first portion that overlaps with the support structure, a second portion that does not overlap, and a third portion that overlaps again. This segmentation allows the signal line to maintain electrical continuity while reducing the overall overlap area with the support structure, thereby preventing adhesive displacement from peeling off the entire signal trace.
Solution Approach 2:
Instead of completely avoiding overlap between signal lines and support structures (which would be ideal but may not be feasible), the patent applies partial overlap - allowing some overlap in specific portions while ensuring the total overlapping area ratio is controlled. This partial action approach balances the need for signal line routing with the need to prevent adhesive displacement.
2Area of stationary object
If signal lines are routed close to support structures for compact design, then device area is reduced, but overlap increases and risk of peeling rises
Solution Approach 1:
The signal line is divided into segments with different overlap characteristics. By segmenting the signal line into portions with and without overlap, the design achieves compact routing near support structures while controlling the total overlapping area to prevent peeling.
Solution Approach 2:
Different portions of the signal line have different overlap characteristics with the support structure. The first and third portions have overlap for compact routing, while the second portion has no overlap to anchor the signal line and prevent peeling. This local differentiation of overlap quality allows compact design without excessive peeling risk.
Data Source
AI summary
A light-emitting substrate includes a substrate, a plurality of signal lines, one or more support structures and a device layer. The substrate includes a first surface. The plurality of signal lines are disposed on the first surface. The one or more support structures are disposed on the first surface. The device layer is disposed on a side of the plurality of signal lines away from the first surface. A ratio of an overlapping area of an orthographic projection of any signal line of the plurality of signal lines on the substrate and an orthographic projection of at least one support structure of the one or more support structures on the substrate to an area of the orthographic projection of the at least one support structure on the substrate is greater than or equal to zero and less than or equal to 0.1.