Backlight Module Silica Gel Layer Light Diffusion

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional direct-type LED backlights suffer from thickness issues, non-uniform light emission, and poor adjustment of backlight areas due to limited LED light sources and increased optical distance requirements.

Innovation Solution

A backlight module incorporating a circuit substrate with LED chips and a silica gel layer that diffuses light, optionally with a phosphor layer and three-dimensional microstructures on the silica gel layer, to enhance light uniformity and reduce module thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the distance between the backlight source and the diffusion plate is increased to improve light uniformity, then the light emission uniformity is improved, but the thickness of the backlight module increases

Engineering Contradiction:
Improvelight emission uniformityVSAvoidthickness of backlight module
Core Design Contradiction:
Illumination intensityVSLength of stationary object

Solution Approach 1:

A liquid crystal layer is introduced as an intermediary substance between the backlight source and the diffusion plate. This liquid crystal layer has adjustable optical properties that enable it to homogenize light distribution without requiring a large physical distance, thus achieving uniform light emission while maintaining a compact module thickness.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The optical properties of the liquid crystal layer are dynamically adjusted by changing parameters such as voltage applied to the liquid crystal. This allows the liquid crystal layer to transition between different optical states, optimizing light uniformity distribution while maintaining a fixed, compact module structure with reduced thickness.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the number of LED light sources is increased to improve local dimming effect, then the adjustment effect of backlight area is improved, but the device complexity increases

Engineering Contradiction:
Improveadjustment effect of backlight areaVSAvoidnumber of LED light sources
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The backlight module is divided into multiple independently controllable regions or zones. Each region can be adjusted separately through the liquid crystal layer's spatially selective optical control, enabling local dimming effects without requiring a corresponding increase in the number of LED light sources. This segmentation allows complex backlight patterns to be achieved with a simpler LED arrangement.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves more uniform light emission and reduces the thickness of the backlight module, improving light distribution and energy efficiency while maintaining a compact design.

Implementation Method 1

the first silica gel layer makes the light emitted from the LED chips more diffuse

Methodology Applied
Scientific EffectLight diffusion: Scattering

Implementation Method 2

the phosphor layer has a thickness less than 0.15 mm... so that the light emitted from the LED chips is uniformly illuminates the phosphor layer

Methodology Applied
Scientific EffectPhosphorescence: Phosphorescence

Data Source

PatentUS11320695B2Backlight and liquid crystal display
Publication Date: 2022.05.03 ELEC TECH PHOTOELECTRIC TECH DALIAN
  • US11320695B2 patent drawing
  • US11320695B2 patent drawing
  • US11320695B2 patent drawing

AI summary

A backlight and a liquid crystal display. The backlight includes: a circuit substrate, a plurality of LED chips and a first silica gel layer. The plurality of LED chips are fixed by means of die bond on the circuit substrate, and the first silica gel layer is applied to the circuit substrate and wraps the plurality of LED chips. The first silica gel layer makes light emitted by the LED chips more diffuse, thus enhancing light emission uniformity of the backlight and reducing a thickness of a backlight module.