Backlight Substrate Signal Layout With Fewer Bonding Pins
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Solution Overview
Problem
Existing light-emitting substrates face challenges in reducing the number of bonding regions and bonding pins, which limits their applicability in devices with space constraints and increases manufacturing complexity and cost.
Innovation Solution
The light-emitting substrate design includes connecting signal lines in a way that reduces the need for direct connections to bonding pins by using connecting lines that extend in a different direction, allowing for fewer bonding regions and pins, thereby simplifying the manufacturing process and improving adaptability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal lines are directly connected to bonding pins in traditional layouts, then electrical connection is achieved, but the number of bonding regions and pins increases, occupying more space and increasing manufacturing complexity
Solution Approach 1:
The patent extends connecting lines in the second direction (transverse direction) to connect signal lines across different columns, rather than using traditional vertical connections in the first direction. This dimensional change allows signal lines to be connected without requiring additional bonding pins, as the connecting lines can route through the functional region to reach target signal lines in adjacent columns.
Solution Approach 2:
The patent introduces first-type connecting lines as intermediary elements that connect signal lines from different columns through the functional region. These connecting lines act as mediators, establishing electrical connections between signal lines without requiring direct bonding pin connections, thereby reducing the number of bonding regions while maintaining connection reliability.
2Reliability
If more bonding pins are used to ensure reliable electrical connections, then connection reliability improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the functions of multiple bonding pins into fewer bonding pins by using first-type connecting lines to extend electrical connections across the functional region. Instead of requiring separate bonding pins for each signal line connection, the connecting lines consolidate multiple connection paths, reducing the total number of bonding pins required while maintaining reliable electrical connections.
Solution Approach 2:
The first-type connecting lines serve multiple functions: they connect signal lines across different columns, provide electrical pathways through the functional region, and reduce the dependency on numerous bonding pins. This multi-functionality allows the bonding structure to achieve reliable connections with fewer components, simplifying the overall device structure.
3Ease of manufacture
If bonding regions are reduced to simplify manufacturing, then ease of manufacture improves, but the ability to provide sufficient electrical connections may be compromised
Solution Approach 1:
The patent creates flexible electrical connection paths through the first-type connecting lines that can adapt to different signal line configurations. The connecting lines extend dynamically across the functional region to reach signal lines in various columns, providing adaptable electrical connections without requiring fixed bonding pin positions. This dynamic routing capability maintains connection versatility while reducing bonding region requirements.
4Area of stationary object
If signal lines are arranged in traditional parallel configurations, then electrical connection is achieved, but space efficiency is reduced and manufacturing complexity increases
Solution Approach 1:
The patent utilizes the second direction (transverse direction) for routing first-type connecting lines to connect signal lines across columns, rather than using traditional parallel arrangements in the first direction only. This dimensional approach allows more efficient space utilization by distributing connecting lines across the width of the substrate, reducing the need for dense parallel signal line arrangements.
Data Source
AI summary
A light-emitting substrate includes a substrate, functional element groups, signal line groups, first-type connecting lines and bonding pins. The functional element groups are arranged in rows in the first direction and in columns in a second direction: the first direction intersects with the second direction. A signal line group is electrically connected to a column of functional element groups, the signal line group includes at least one first-type signal line, and all first-type signal lines each extend in the first direction and are arranged at intervals in the second direction. A first-type connecting line is used to connect first-type signal lines transmitting a same signal in at least two signal line groups. Among the first-type signal lines electrically connected to the first-type connecting line, at least one first-type signal line is spaced apart from the bonding pins.