Backlight Module Layout Using Substrate Thickness for Light Uniformity
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Solution Overview
Problem
Existing direct-lit backlight modules face challenges in achieving both better light uniformity and reduced thickness, as increasing optical distance for uniformity leads to increased module thickness, and reducing optical distance compromises light uniformity.
Innovation Solution
A backlight module design featuring a light-transmitting substrate with light sources positioned away from the light-emitting side, a first film layer with a recess exposing electrodes, and a metal layer with connection electrodes, allowing for reusing substrate thickness as optical distance and optimizing light uniformity and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If optical distance is increased to improve light uniformity, then light uniformity is improved, but module thickness increases
Solution Approach 1:
The patent merges the substrate and support function by making the light-transmitting substrate directly serve as the support structure for light sources. The substrate's thickness is reused as the optical distance, eliminating the need for additional support layers or spacing structures, thus achieving both thinness and adequate optical distance.
Solution Approach 2:
The patent positions light sources on the back side of the substrate rather than requiring lateral spacing, utilizing the thickness dimension of the substrate as the optical distance. This dimensional approach allows light uniformity optimization without increasing overall module thickness.
2Length of stationary object
If optical distance is reduced to decrease module thickness, then module thickness is reduced, but light uniformity deteriorates
Solution Approach 1:
The substrate serves dual functions as both support structure and optical spacing element. By positioning light sources on the back side and using the substrate thickness as optical distance, the design achieves compact thickness while maintaining sufficient optical path for light uniformity.
3Length of stationary object
If light sources are positioned close to light-transmitting substrate to reduce thickness, then module thickness is reduced, but heat dissipation becomes difficult
Solution Approach 1:
The patent segments the substrate into front and back sides with different functions: the front side transmits light to the display, while the back side accommodates light sources and serves as heat dissipation interface. This segmentation allows thermal management without compromising optical performance or increasing thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved light uniformity and reduced module thickness by reusing substrate thickness as optical distance, enhancing heat dissipation and light emission efficiency.
Implementation Method 1
a plurality of light sources located on a side of the light-transmitting substrate, where the plurality of light sources respectively include a light-emitting surface
Implementation Method 2
enhancing heat dissipation and light emission efficiency
Data Source
AI summary
Provided are a backlight module, a manufacturing method thereof and a display device. The backlight module includes: a light-transmitting substrate; light sources and a first film layer located on a same side of the substrate; and a first metal layer located on a side of the first film layer away from the substrate. The light source includes a light-emitting surface and an electrode located on two opposite sides of the substrate. A distance between a surface of the first film layer away from the substrate and the substrate is greater than that between a surface of the electrode away from the substrate and the substrate. The first film layer is provided with a first recess, and the first recess exposes at least part of the electrode. The first metal layer includes a connection electrode, and the connection electrode is connected with the electrode in the first recess.