Backlight Substrate Adhesive Curing to Prevent Metal Oxidation
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Solution Overview
Problem
Current micro light-emitting diode (Mini/Micro LED) substrate manufacturing processes face challenges in achieving low resistance metal wiring and efficient bonding methods, particularly in the use of conductive adhesives and reflow soldering, which can lead to oxidation issues and reduced production efficiency.
Innovation Solution
The proposed solution involves a substrate design with a bonding region and multiple light-emitting regions, where the light-emitting regions include a first metal layer coated with a photo-curing conductive adhesive, and the bonding region includes a second metal layer with a thermal-curing conductive adhesive. This design allows for selective curing of the adhesives using light or heat, avoiding oxidation of the metal layers and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reflow soldering method is used to cure conductive adhesive, then bonding strength is improved, but metal layer oxidation occurs due to high temperature (230°C-260°C)
Solution Approach 1:
The patent changes the curing method from thermal (reflow soldering at 230°C-260°C) to UV light curing. The UV-curing conductive adhesive is cured by UV light irradiation instead of high temperature heating, which eliminates the oxidation problem caused by high temperature while maintaining bonding strength. This parameter change from thermal to optical curing resolves the contradiction between bonding strength and oxidation prevention.
Solution Approach 2:
The patent replaces the thermal field (heat-based reflow soldering) with an optical field (UV light-based curing). By substituting the curing mechanism from thermal energy to optical energy, the patent achieves adhesive curing without high temperature exposure, thereby preventing metal layer oxidation while maintaining effective bonding.
2Reliability
If conventional hot-pressing method is used for FPC bonding, then bonding is achieved, but production efficiency is reduced due to oxidation issues
Solution Approach 1:
The patent changes the curing parameter from temperature-based (hot-pressing at 130°C-150°C) to light-based (UV curing). The UV-curing conductive adhesive can be cured rapidly by UV light irradiation without requiring prolonged high temperature exposure, which eliminates oxidation issues and significantly improves production efficiency while maintaining bonding reliability.
Solution Approach 2:
The UV curing process allows the conductive adhesive to cure rapidly and completely in a short time exposure to UV light, skipping the prolonged thermal processing required by conventional hot-pressing methods. This rapid curing approach prevents oxidation from occurring during extended heating periods while maintaining reliable bonding, thereby improving production throughput.
3Reliability
If copper metal is used for wiring, then electrical conductivity is improved, but oxidation resistance deteriorates during high temperature curing
Solution Approach 1:
The patent changes the curing parameter from high temperature (230°C-260°C reflow soldering) to UV light irradiation. This parameter change allows copper metal wiring to maintain its excellent electrical conductivity without exposure to high temperatures that would cause oxidation, thereby preserving both conductivity and oxidation resistance simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the production efficiency and product yield by preventing oxidation of the metal layers during the curing process, while also improving the conductive properties of the adhesives through the use of nano metal powders and conductive metal balls.
Implementation Method 1
the first conductive adhesive is a photo-curing conductive adhesive... the photo-curing conductive adhesive is a UV-curing conductive adhesive or a laser-curing conductive adhesive
Implementation Method 2
the photo-curing conductive adhesive is a UV-curing conductive adhesive or a laser-curing conductive adhesive
Implementation Method 3
the second conductive adhesive is a thermal-curing conductive adhesive
Data Source
AI summary
A substrate, a backlight module, and a display apparatus, which relates to the technical field of display. The substrate is configured to display or provide a backlight, and the substrate includes: a bonding region (OB) and a plurality of light-emitting regions (OA); each of the plurality of light-emitting regions (OA) includes a first metal layer (1) and a first conductive adhesive (2) located on the first metal layer (1), the first conductive adhesive (2) is a photo-curing conductive adhesive; and the bonding region (OB) includes a second metal layer (3) and a second conductive adhesive (4) located on the second metal layer (3).