Backlight Substrate with Slit Buffer Structures for Warpage Reduction
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Solution Overview
Problem
Existing display technologies face challenges in maintaining the structural integrity and reliability of substrates used in backlight modules, particularly due to thermal expansion differences between the reflective layer and the circuit board, leading to warping and potential cracking of encapsulation portions.
Innovation Solution
The substrate incorporates a first reflective layer with a central region and a peripheral region, featuring buffer structure groups with slits that disperse stress and reduce displacement accumulation, thereby minimizing warping and enhancing the structural integrity of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a continuous reflective layer is used to improve light extraction efficiency, then light extraction efficiency is improved, but thermal expansion stress causes warping and structural integrity deteriorates
Solution Approach 1:
The continuous reflective layer is segmented into multiple discrete reflective regions separated by buffer structure groups. These buffer structures divide the reflective layer into independent segments that can expand and contract independently, reducing cumulative thermal stress while maintaining adequate light extraction efficiency through the distributed reflective regions.
Solution Approach 2:
Different regions of the substrate are given different properties: reflective regions maintain high reflectivity for light extraction, while buffer structure regions are designed with stress-absorbing characteristics. The buffer structures have specific geometric configurations that allow them to accommodate thermal expansion locally without compromising the overall structural integrity.
2Reliability
If the reflective layer is made continuous to improve reflectivity, then reflectivity is improved, but thermal expansion differences cause warping
Solution Approach 1:
The reflective layer is divided into multiple discrete reflective regions rather than a continuous layer. Each reflective region maintains high reflectivity for its local area, and the buffer structures between them accommodate differential thermal expansion, preventing warping while preserving overall reflectivity.
Solution Approach 2:
The geometric parameters of the buffer structures (size, shape, spacing) are optimized to accommodate thermal expansion. The buffer structures are designed with specific dimensions that allow them to absorb expansion stress without causing the reflective regions to warp or detach from the substrate.
3Stability of the object's composition
If buffer structures are added to reduce stress, then structural integrity is improved, but light extraction efficiency may deteriorate
Solution Approach 1:
The buffer structures are designed with specific local geometric properties that minimize their impact on light extraction. By optimizing the size, shape, and spacing of the buffer structures, they provide stress relief while occupying minimal area, allowing the majority of the substrate surface to remain dedicated to light extraction functions.
Solution Approach 2:
The buffer structures are designed with dimensions that are sufficient to provide stress relief but not so large as to significantly block light paths. The spacing and size are optimized to provide just enough buffer capacity to prevent warping while maintaining adequate light extraction efficiency through the reflective regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage and the risk of cracking in the encapsulation portions, improving the waterproofness and corrosion resistance of the substrate, and enhancing the light extraction efficiency and display quality of the display device.
Implementation Method 1
The first reflective layer is disposed on the circuit board... The first reflective layer includes at least one first buffer structure group
Data Source
AI summary
A substrate includes a circuit board and a first reflective layer. The first reflective layer is disposed on the substrate. The first reflective layer has a central region and a peripheral region surrounding the central region. The first reflective layer includes at least one first buffer structure group, and an orthogonal projection of the first buffer structure group on the circuit board falls into the peripheral region. Each first barrier structure group includes a plurality of first slits spaced apart from each other, and a plurality of first slits in any first buffer structure group are disposed around the central region.