Backlight System Modular Frame Heat Dissipation

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Solution Overview

Problem

Conventional backlight systems for liquid crystal display devices have high material costs and inefficient heat dissipation due to complex and costly back frame designs, which require large-sized molds and consume significant resources without effective heat dissipation performance.

Innovation Solution

A backlight system with a back frame composed of two primary assembling pieces joined to form a main frame structure, where the light source is carried by one piece and heat dissipation elements are densely arranged near the light source to optimize heat dissipation, using thermally conductive materials and aluminum extrusions with heat dissipation fins or blocks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a unitary back frame is used with metal stamping or plastic injection molding, then the structure is simple and easy to manufacture, but the material cost is high and large-sized molds are required

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmaterial consumption
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The back frame is divided into multiple modular components (first back frame component, second back frame component, third back frame component) that can be assembled together. This segmentation reduces material consumption for each component while maintaining the overall structural integrity, and eliminates the need for large-sized single-piece molds.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If heat dissipation structures are uniformly distributed or irregularly distributed, then the design is simple, but the heat dissipation efficiency is not improved as expected

Engineering Contradiction:
Improvedesign simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

Heat dissipation holes are non-uniformly distributed with different densities in different regions of the back frame components. The first back frame component has heat dissipation holes with first density, while the second back frame component has heat dissipation holes with second density that is different from the first density. This local variation optimizes heat dissipation efficiency by concentrating holes in regions with higher heat generation.

Inventive Principle:
Principle #3Local quality

3Productivity

If conventional heat dissipation measures are used with uniform or irregular distribution, then the design and manufacturing steps are reduced, but excellent heat dissipation performance is not achieved

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidheat dissipation performance
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The back frame components are made from aluminum alloy materials with optimized local properties. Heat dissipation holes are strategically distributed with varying densities in different components to match local heat generation patterns, achieving excellent heat dissipation performance while maintaining manufacturing efficiency through modular assembly.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The back frame system uses aluminum alloy materials that combine structural integrity with thermal conductivity. The composite structure of multiple aluminum alloy components with strategically placed heat dissipation holes achieves both mechanical strength and optimized heat dissipation performance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing costs, simplifies the back frame structure, and enhances heat dissipation efficiency by concentrating heat dissipation elements where heat is most intense, improving overall heat dissipation performance.

Implementation Method 1

the primary assembling piece that carries the light source is made of a thermally conductive material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipation elements are heat dissipation fins or heat dissipation blocks

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the heat dissipation elements are heat dissipation fins or heat dissipation blocks

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS8727551B2Backlight system
Publication Date: 2014.05.20 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US8727551B2 patent drawing
  • US8727551B2 patent drawing
  • US8727551B2 patent drawing

AI summary

The present invention provides a backlight system, which includes a light source; and a back frame, which includes at least two primary assembling pieces, the at least two primary assembling pieces being joined to form a main frame structure of the back frame; wherein the light source is carried by a first side of at least one of the primary assembling pieces, the backlight system further comprising heat dissipation elements, the heat dissipation elements having a distribution that is denser at locations closer to a center of the primary assembling piece that carries the light source in a lengthwise direction of the primary assembling piece that carries the light source. The backlight system of the present invention forms a back frame through joining so as to make the structure of the back frame simple and reduces the manufacturing cost of the backlight system, and further, through an arrangement that heat dissipation elements are arranged more densely on the primary assembling piece that carries a light source at locations closer to a center thereof in the lengthwise direction, the heat dissipation efficiency and heat dissipation performance of the backlight system are improved.