Backlight Device Thermal Management via Segmented PCB

The heat radiation function is segmented into multiple independent heat radiation regions corresponding to different LED element groups. Each region has its own heat radiation path through the substrate, allowing independent control and optimization of heat dissipation for each LED group, thereby achieving uniform heat radiation characteristics across the entire system.

Different regions of the substrate are designed with locally optimized heat radiation structures. The heat radiation regions are positioned and configured according to the specific heat generation characteristics of each LED element group, creating non-uniform local heat radiation paths that collectively achieve uniform overall heat radiation performance.

The substrate is divided into functionally distinct regions: electrical connection regions for conducting electricity to LED elements and heat radiation regions for dissipating heat. These segmented regions are spatially separated and independently designed, allowing each function to be optimized without interfering with the other, thus maintaining reliability while managing complexity.

The substrate acts as an intermediary structure that separately provides both electrical connection paths and heat radiation paths. By using the substrate as a mediator that independently handles both functions through distinct regions, the design achieves reliable electrical connection and uniform heat radiation without requiring complex integrated structures.

The LED element array is divided into multiple groups, with each group having its own dedicated heat radiation region and path. This segmentation prevents heat accumulation in any single area, allowing high power output across the entire array while avoiding thermal saturation that would cause efficiency deterioration.

Each LED element group is positioned over a locally optimized heat radiation region with tailored thermal conductivity and geometry. This local quality optimization ensures that heat is efficiently removed from each high-power LED group, preventing thermal saturation and maintaining efficiency even at high overall power levels.

The substrate performs multiple functions simultaneously: it provides mechanical support, enables electrical connection through conductive regions, and facilitates heat radiation through thermally conductive regions. This multi-functionality allows the device to be thinned by reducing the number of separate members while maintaining heat radiation capability through the substrate's integrated thermal management function.

The substrate's thermal conductivity parameter is optimized in the heat radiation regions to compensate for the reduced device thickness. By changing the thermal conductivity parameter locally in the substrate, the design maintains effective heat radiation capability even with fewer members and reduced overall thickness.