Backlight Unit Transformer Shielding and Thermal Management
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Solution Overview
Problem
Backlight units in display devices face issues with leakage flux and heat dissipation, particularly due to the transformer's magnetic field interference and heat generation, which affect the efficiency and reliability of the display.
Innovation Solution
Incorporating a heat dissipating cover between the transformer cover and the bottom cover to block leakage flux and disperse conductive heat, utilizing a transformer with a core and coil design, and a light emitting module with LEDs mounted on a substrate, along with a reflection plate and optical member for efficient light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a transformer is mounted in the backlight unit, then power conversion is enabled, but leakage flux causes magnetic field interference
Solution Approach 1:
A shield plate is introduced as an intermediary component between the transformer and other parts of the backlight unit. This shield plate blocks and redirects the leakage flux, preventing magnetic field interference with surrounding components while allowing the transformer to perform its power conversion function normally.
Solution Approach 2:
The leakage flux that would normally cause harmful magnetic field interference is redirected and channeled through a magnetic shield to a designated path, converting the harmful stray flux into controlled magnetic flow that exits through a predetermined route, thus eliminating interference while maintaining electromagnetic efficiency.
2Power
If a transformer is mounted in the backlight unit, then power conversion is enabled, but heat generation affects system reliability
Solution Approach 1:
A heat dissipation cover is introduced as an intermediary thermal management component between the transformer and the backlight unit housing. This cover conducts heat away from the transformer and distributes it to a larger surface area, preventing localized overheating and improving system reliability.
Solution Approach 2:
The thermal parameters of the transformer environment are changed by introducing a heat dissipation cover with high thermal conductivity. This cover changes the heat transfer coefficients and temperature distribution, maintaining the transformer's power conversion function while operating at lower temperatures for improved reliability.
3Reliability
If a heat dissipating cover is added to block leakage flux and disperse heat, then reliability is improved, but device complexity increases
Solution Approach 1:
The heat dissipating cover is designed to perform multiple functions simultaneously: it acts as a thermal management component, a magnetic shielding element, and a structural support piece. By combining multiple functions into a single component, the overall device complexity is minimized while achieving improved reliability.
Solution Approach 2:
The heat dissipating cover integrates magnetic shielding functionality with thermal management functionality, merging two separate protective functions into one component. This consolidation reduces the total number of parts and simplifies the assembly process while maintaining both magnetic field protection and heat dissipation capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively blocks leakage flux and disperses heat, enhancing the reliability and efficiency of the backlight unit and display device by reducing heat transfer and magnetic field interference, thereby improving overall system performance.
Implementation Method 1
a heat dissipating cover between the transformer cover and the bottom cover
Implementation Method 2
disperses conductive heat with a heat dissipating cover attached to a transformer cover
Data Source
AI summary
A backlight unit of an embodiment includes: a light emitting module including a plurality of light emitting diodes and a module substrate on which the light emitting diodes are mounted; a bottom cover accommodating the light emitting module; a board on the bottom cover; a transformer mounted on a lower portion of the board, and including a core and a coil surrounding at least one portion of the core; a transformer cover covering the transformer; and a heat dissipating cover between the transformer cover and the bottom cover.