Backlight Unit Drive IC Cooling and Sealing via Chassis Protrusions
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing backlight units for display devices face challenges in efficiently cooling drive IC elements while minimizing dust entry and light leakage, particularly in driver on board (DOB) configurations, where traditional heat sinks are expensive and bulky, and conventional heat radiation structures are prone to dust and light leakage.
Innovation Solution
A backlight unit design featuring an LED substrate with drive IC elements on one surface and a chassis with protrusions that house IC element covers, which include heat radiation sheets and insulation layers to facilitate efficient cooling and sealing, reducing dust and light entry through a fitting structure with a sealing property.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional heat sink is used to cool drive IC elements, then cooling effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The chassis is designed to integrate both structural support and heat dissipation functions. The chassis includes heat radiation surfaces that directly contact the drive IC elements, merging the cooling function into the existing structural component rather than adding a separate heat sink assembly.
Solution Approach 2:
The chassis serves multiple functions: it provides mechanical support for the LED substrate and drive IC elements, acts as a heat dissipation structure through its heat radiation surfaces, and serves as a mounting structure for additional components. This multi-functionality eliminates the need for dedicated heat sink components.
2Length of stationary object
If a DOB configuration is used to reduce thickness, then device thickness is reduced, but dust entry and light leakage problems occur
Solution Approach 1:
The IC element cover is designed with localized sealing structures that specifically address dust and light leakage at the critical interface between the DOB configuration components. The cover includes a sealing portion that fits into a corresponding groove in the chassis, creating a localized seal without affecting the overall thin-profile design.
Solution Approach 2:
The IC element cover acts as an intermediary component between the DOB configuration elements (chassis and drive IC elements). It provides a sealing interface that prevents dust and light leakage while maintaining the compact DOB structure, effectively mediating the harmful effects without compromising the thickness reduction benefit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively cools drive IC elements, reduces dust and light leakage, and offers a cost-effective alternative to traditional heat sinks by using a DOB configuration with a sealing property that prevents dust entry and enhances heat dissipation.
Implementation Method 1
heat radiation sheet disposed between the drive IC element and the IC element cover
Implementation Method 2
heat insulation sheet disposed between the chassis and the IC element cover
Data Source
AI summary
A backlight unit includes an LED substrate including a first main surface and a second main surface on a side opposite to the first main surface, a plurality of LED elements arranged on the first main surface, one or more drive IC elements arranged on the second main surface, a chassis disposed on the second main surface side of the LED substrate, and one or more IC element covers each being in direct or indirect contact with a corresponding drive IC element of the one or more drive IC elements. The chassis includes one or more protrusions respectively corresponding to the one or more drive IC elements. Each of the one or more protrusions includes an opening that exposes the corresponding drive IC element when viewed from a normal direction of the second main surface. The IC element cover fits in the protrusion.