Backlight Unit Groove Heat Dissipation Zener Diodes
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Solution Overview
Problem
Current backlight units for display devices face challenges in reducing manufacturing costs and suppressing color discoloration, which affects the uniformity and quality of displayed images.
Innovation Solution
The proposed backlight unit design includes an array substrate with light emitting devices and Zener diodes, a driver substrate with driver ICs, and a cover bottom with grooves to accommodate these components, allowing for efficient heat dissipation and reduced heat transfer, thereby minimizing discoloration and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to the backlight unit, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing structural components by forming grooves directly on the array substrate and driver substrate surfaces. These grooves serve dual purposes: they provide heat dissipation pathways while also acting as mounting locations for Zener diodes and driver ICs, thereby improving heat dissipation without adding separate heat dissipation structures that would increase device complexity.
Solution Approach 2:
The patent applies local quality by creating grooves at specific locations where heat generation occurs (near light emitting devices and driver ICs). The grooves are strategically positioned to target heat dissipation at critical hot spots rather than implementing a uniform heat dissipation structure across the entire backlight unit, thus improving heat dissipation performance with minimal structural modification.
2Ease of manufacture
If Zener diodes are disposed in grooves on the array substrate, then manufacturing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-forming the grooves on the array substrate and driver substrate during the manufacturing process before mounting the Zener diodes and driver ICs. This preliminary structuring allows for standardized placement and simplifies the subsequent assembly process, reducing manufacturing costs while maintaining acceptable precision through automated placement techniques.
Solution Approach 2:
The grooves act as intermediary structures that facilitate the mounting of Zener diodes and driver ICs. By providing pre-formed recesses, the grooves serve as intermediaries that bridge the substrate surface and the components to be mounted, enabling cost-effective assembly while accommodating the precision requirements through standardized geometric features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light efficiency, reduces manufacturing costs, and maintains uniform luminance by preventing heat-induced discoloration, resulting in improved image quality and cost-effectiveness.
Implementation Method 1
at least one corresponding Zener diode of a plurality of Zener diodes is respectively disposed in the plurality of first grooves
Implementation Method 2
at least one corresponding driver IC of a plurality of driver ICs is respectively disposed in the plurality of second grooves
Data Source
AI summary
The disclosure relates to backlight unit and display device including the same. The backlight unit includes an array substrate having a first surface on which a plurality of light emitting devices are disposed, and a second surface on which a plurality of Zener diodes are disposed corresponding to the plurality of light emitting devices, a driver substrate having a third surface contacting the second surface of the array substrate, and a fourth surface on which a plurality of driver integrated circuits are disposed, and a cover bottom accommodating the array substrate and the driver substrate.