Backlight Module Via Hole Design for Thin Bezel Assembly
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Solution Overview
Problem
The existing backlight module designs with stepped iron cases increase the thickness and create unevenness, complicating assembly with glass and requiring special fixtures due to the need for recesses to accommodate flexible circuit boards, which hinders the achievement of a narrow bezel and uniform light distribution.
Innovation Solution
A backlight module with a metal case featuring a via hole to accommodate a flexible circuit board of matching size, eliminating the need for a stepped design, and integrating injection molding to embed the circuit board directly within the case, reducing overall thickness and facilitating smoother assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a stepped iron case is designed to accommodate the flexible circuit board, then the circuit board can be properly positioned, but the thickness of the backlight module increases
Solution Approach 1:
The flexible circuit board is nested within a cavity formed in the iron case, allowing the circuit board to be accommodated without increasing the external dimensions of the backlight module. The cavity integrates the circuit board housing into the case structure itself, achieving space-efficient nesting.
Solution Approach 2:
Instead of adding thickness in the vertical dimension to accommodate the circuit board, the design creates a cavity in the horizontal plane of the iron case. This dimensional shift allows the circuit board to be positioned properly without increasing the overall thickness of the backlight module.
2Ease of operation
If a stepped iron case is designed to accommodate the flexible circuit board, then the circuit board can be properly positioned, but the back side of the backlight becomes uneven
Solution Approach 1:
The cavity is created only in the local region where the flexible circuit board needs to be positioned, while the rest of the iron case maintains its original flat structure. This localized modification ensures the circuit board is properly positioned without compromising the overall flatness of the back side.
Solution Approach 2:
The flexible circuit board is nested within the cavity, allowing it to be accommodated in a localized area. This nesting approach preserves the flat external surface of the iron case while providing the necessary positioning structure for the circuit board.
3Ease of operation
If a stepped iron case is designed, then the flexible circuit board can be accommodated, but special platform fixtures are required for assembly
Solution Approach 1:
The iron case itself provides the positioning function through the integrated cavity, eliminating the need for external platform fixtures. The case structure serves its own positioning requirement by incorporating the cavity that accommodates the flexible circuit board during assembly.
Solution Approach 2:
The positioning function and the structural housing function are merged into a single integrated iron case design. The cavity for accommodating the flexible circuit board is formed as part of the case itself, combining multiple functions into one component and eliminating the need for separate positioning fixtures.
Data Source
AI summary
A backlight module, a method of manufacturing the same, and a display device are provided. The backlight module includes a case provided with a via hole; and a flexible circuit board disposed in the via hole and having a size matching a size of the via hole.