Backlight Wiring Structure for Lower-Cost LED Connectivity
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Solution Overview
Problem
Current backlight units for non-luminous display devices, such as liquid crystal display devices, face challenges in reducing material costs and simplifying manufacturing processes while maintaining effective light emission and electrical connectivity.
Innovation Solution
A backlight unit design featuring a base substrate with defined light emitting and non-light emitting areas, incorporating a three-layer wiring structure with a lower conductive layer, an intermediate conductive layer, and an upper conductive layer, along with a light emitting element connected via a connection member, and a flexible substrate connected through a pad connection member, which includes a wavelength converter to emit blue light converted into red and green light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a substrate with a wiring layer formed on a separate base substrate is used instead of a printed circuit board, then material costs are reduced, but the complexity of electrical connectivity and light distribution may increase
Solution Approach 1:
The wiring layer is divided into three separate conductive layers (lower, intermediate, and upper) that can be independently formed and optimized. This segmentation allows each layer to serve specific functions: the lower layer provides structural support and ground connections, the intermediate layer handles signal routing, and the upper layer provides corrosion resistance and additional connectivity, thereby reducing overall material costs while managing complexity through functional division
Solution Approach 2:
The patent employs a composite wiring structure with three different conductive layers, each potentially made from different materials optimized for their specific function. This composite approach allows the use of cost-effective materials in non-critical layers while maintaining high performance in critical areas, thus reducing overall material costs without compromising electrical connectivity
2Reliability
If a three-layer wiring structure is used, then electrical connectivity and corrosion resistance are improved, but the manufacturing process complexity increases
Solution Approach 1:
The lower conductive layer is formed first on the base substrate to establish the foundational electrical connectivity and ground references before subsequent layers are added. This preliminary action ensures that the structural and electrical framework is in place early in the manufacturing process, simplifying subsequent assembly steps and improving overall manufacturing efficiency
Solution Approach 2:
The intermediate conductive layer serves as a mediator between the lower and upper layers, providing both electrical connectivity and a platform for forming connection members. This intermediate layer facilitates the integration of light emitting elements and other components, thereby simplifying the overall manufacturing process while maintaining high electrical connectivity and corrosion resistance
3Reliability
If connection members contact the intermediate conductive layer, then electrical connectivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The connection members extend vertically through the insulating layer to contact the intermediate conductive layer, utilizing the third dimension (depth) to achieve electrical connectivity. This vertical arrangement in another dimension allows for better alignment tolerance compared to planar connections, as the connection can be established through depth rather than requiring precise lateral positioning
4Illumination intensity
If a base substrate with defined light emitting and non-light emitting areas is used, then light emission efficiency is improved, but the device complexity increases
Solution Approach 1:
The base substrate is designed with spatially varying properties: light emitting areas with specific optical characteristics for light generation and non-light emitting areas with different characteristics for light guidance and structural support. This local quality differentiation optimizes light emission efficiency in the emitting areas while maintaining structural integrity and light management in the non-emitting areas, without requiring complex overall device architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces material costs, simplifies the manufacturing process, and enhances light emission efficiency by using a three-layer wiring structure for improved electrical connectivity and light distribution, resulting in a cost-effective and efficient backlight unit for display devices.
Implementation Method 1
a wavelength converter disposed on the base substrate and configured to convert a wavelength of incident light
Data Source
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AI summary
A backlight unit includes: a base substrate in which a light emitting area and a non-light emitting area are defined; a wiring layer including: a lower conductive layer disposed on the base substrate; an intermediate conductive layer disposed on the lower conductive layer; and an upper conductive layer disposed on the intermediate conductive layer; a light emitting element disposed on the wiring layer in the light emitting area; a connection member electrically connecting the light emitting element and the wiring layer, the connection member contacting the intermediate conductive layer of the wiring layer and the light emitting element; a backlight flexible substrate electrically connected to the wiring layer in the non-light emitting area; and a pad connection member electrically connecting the wiring layer and the backlight flexible substrate in the non-light emitting area, the pad connection member contacting the upper conductive layer of the wiring layer.