Integrated Backlight Wiring Structure Without PCB Mounting
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Solution Overview
Problem
Existing backlight units fail to provide a cost-effective and efficient solution for reducing manufacturing costs in the production of display devices.
Innovation Solution
A backlight unit is designed with a substrate having a wiring layer formed on a separate base substrate instead of a printed circuit board, incorporating a lower and upper conductive layer, a light emitting element, and a connection member to reduce material costs and simplify the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is used as the substrate for mounting light emitting elements, then the structural stability and electrical connection reliability are improved, but the manufacturing cost and device complexity increase
Solution Approach 1:
The patent merges the substrate and wiring layer into a single integrated structure. The base substrate itself serves as the mounting platform for light emitting elements, while conductive layers (first and second conductive layers) are formed directly on the base substrate to provide electrical connections. This eliminates the need for a separate printed circuit board, reducing device complexity while maintaining electrical connection reliability through the integrated wiring layer design.
Solution Approach 2:
The base substrate performs multiple functions simultaneously: it serves as the mechanical support structure for mounting light emitting elements, as the foundation for forming conductive wiring layers, and as part of the overall electrical connection system. This multi-functionality reduces the need for separate dedicated components, thereby simplifying the overall device structure while maintaining reliability.
2Reliability
If a printed circuit board is used as the substrate, then the electrical connection and structural support are improved, but the manufacturing cost increases
Solution Approach 1:
By combining the substrate and wiring layer functions into a single integrated component, the patent reduces the total number of parts that need to be manufactured and assembled. The conductive layers are formed directly on the base substrate through deposition processes, eliminating the need for separate PCB manufacturing and assembly steps, thereby reducing manufacturing cost while maintaining electrical connection reliability.
Solution Approach 2:
The patent employs composite material structures where conductive materials (such as aluminum, copper, or their alloys) are deposited on the base substrate to form the wiring layer. This composite approach allows optimization of each layer for its specific function while achieving overall cost-effectiveness through reduced material usage and simplified manufacturing processes compared to traditional PCB-based solutions.
3Ease of manufacture
If the upper conductive layer is disposed only in the non-light emitting area, then the manufacturing cost is reduced, but the electrical connection efficiency may be affected
Solution Approach 1:
The patent applies local quality by positioning the upper conductive layer specifically in the non-light emitting area where it is needed for electrical connections and signal routing. In the light emitting area, only the lower conductive layer is present to minimize light interference and maintain display quality. This localized arrangement reduces manufacturing cost by limiting material usage to where it is functionally necessary, while maintaining electrical connection efficiency through proper design of the connection paths in the non-light emitting area.
Solution Approach 2:
The conductive wiring structure is segmented into different layers and areas: the lower conductive layer spans the entire base substrate including light emitting areas, while the upper conductive layer is segmented to exist only in non-light emitting areas. This segmentation allows each layer to perform its specific function optimally, reducing overall material cost while maintaining necessary electrical connections through the coordinated design of both segments.
Data Source
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AI summary
A backlight unit includes: a base substrate in which a light emitting area and a non-light emitting area are defined; a wiring layer including: a lower conductive layer disposed on the base substrate; an intermediate conductive layer disposed on the lower conductive layer; and an upper conductive layer disposed on the intermediate conductive layer; a light emitting element disposed on the wiring layer in the light emitting area; a connection member electrically connecting the light emitting element and the wiring layer, the connection member contacting the intermediate conductive layer of the wiring layer and the light emitting element; a backlight flexible substrate electrically connected to the wiring layer in the non-light emitting area; and a pad connection member electrically connecting the wiring layer and the backlight flexible substrate in the non-light emitting area, the pad connection member contacting the upper conductive layer of the wiring layer.