Backplane Airflow Channels for Compute Node Cooling
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Solution Overview
Problem
Existing data center cooling systems often fail to provide effective air cooling where it is most needed, leading to uneven heat removal and potential server failures due to inadequate airflow distribution, especially in non-uniform rack configurations with varying component densities.
Innovation Solution
A computing system design that includes a chassis with backplanes and air channels between circuit board assemblies, where air is introduced from the bottom and flows through openings in the backplanes to channels between adjacent boards, allowing for continuous cooling even when compute nodes are partially withdrawn for maintenance, using channel-capping elements to maintain airflow and heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are used to move air from front to back in the rack, then heat removal from components is improved, but airflow distribution becomes non-uniform causing some areas to receive more cooling air than others
Solution Approach 1:
The patent introduces air at multiple locations (front, rear, and bottom of the chassis) rather than a single location, creating localized cooling zones that correspond to different heat generation areas in the rack. This ensures uniform airflow distribution to all components regardless of their position.
Solution Approach 2:
The patent adds a vertical dimension to airflow by introducing cooling air from the bottom of the chassis upward through the rack components, in addition to traditional front-to-back horizontal flow. This multi-dimensional approach ensures all areas receive adequate cooling.
2Ease of repair
If all servers on a common chassis must be withdrawn to service one failed server, then defective component replacement is enabled, but cooling air to all servers on that chassis is lost causing performance impairment or additional failures
Solution Approach 1:
The patent divides the cooling system into independent zones with multiple air intake locations (front, rear, bottom) so that cooling can be maintained for remaining functional servers even when one server is removed for maintenance. Each zone can operate independently.
Solution Approach 2:
The patent ensures continuous cooling operation during server maintenance by providing multiple air intake paths and distributing air to individual server channels, allowing cooling to persist even when one server is withdrawn from the chassis.
3Ease of manufacture
If air is introduced from the front of the rack, then initial cooling airflow is established, but air does not reach components effectively where it is most needed in non-uniform rack configurations
Solution Approach 1:
The patent introduces air at multiple locations (front, rear, and bottom of the chassis) rather than a single location, creating localized cooling zones that correspond to different heat generation areas in the rack. This ensures uniform airflow distribution to all components regardless of their position.
Solution Approach 2:
The patent introduces air from the bottom of the chassis upward, which is the opposite of traditional top-down or front-only approaches. This inverted approach allows air to reach components more effectively by flowing upward through channels between circuit boards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures consistent airflow and heat removal across compute nodes, preventing failures and allowing for maintenance without disrupting cooling, even when nodes are partially withdrawn from the rack, thus enhancing system reliability and operational efficiency.
Implementation Method 1
The air passage receives air from an air inlet end of the system. The one or more backplanes include openings that allow air to pass from the air passage to the air channels
Implementation Method 2
Air channels are formed between adjacent circuit board assemblies of the computing devices and the one or more backplanes
Data Source
AI summary
A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.