Backplane Board Blind Hole Press-Fit Connections
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Solution Overview
Problem
Current on-board avionics systems face issues with excessive cost, obsolescence, and poor electromagnetic compatibility due to the wrapping method used for connecting electronic cards to backplane boards, which also leads to noise reflections and reduced compactness.
Innovation Solution
The proposed solution involves a backplane electronic card with blind holes covered by insulating polymer and through-holes that prevent resin rise, eliminating wired connections and additional components, allowing for increased board length and filtering functions, while using press-fit connection elements and metallized holes for secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the wrapping method is used to connect electronic cards to backplane boards, then electrical connections can be established, but the connection space becomes excessive and compactness is reduced
Solution Approach 1:
The patent merges the connection elements directly into the backplane board structure by creating blind holes within the board substrate. This eliminates the need for separate wrapping wires and external connectors, integrating the connection function into the board itself and significantly reducing the space required for connections.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting approach (wrapping wires on the board surface) to a three-dimensional approach by drilling blind holes through the board thickness. This vertical integration allows connection elements to be embedded within the board volume rather than occupying external space, improving compactness.
2Reliability
If the wrapping method is used for connections, then electrical connectivity is achieved, but electromagnetic compatibility performance deteriorates due to noise and reflection phenomena
Solution Approach 1:
The patent replaces the mechanical wrapping wire connection system with an integrated PCB blind hole connection system. This substitution eliminates the mechanical wire-wrapping process and replaces it with a controlled impedance trace structure that can be precisely engineered for optimal electromagnetic performance, reducing noise and reflections.
Solution Approach 2:
The patent changes the connection geometry from external wrapping wires to internal blind hole structures. This parameter change allows for controlled impedance design, proper grounding, and optimized signal paths that significantly improve electromagnetic compatibility by minimizing reflections and noise interference.
3Ease of manufacture
If resin is used to glue printed circuits together, then assembly is simplified, but resin rises into blind holes preventing pin-shaped connection elements from being inserted
Solution Approach 1:
The patent applies preliminary action by filling the blind holes with a protective material (such as epoxy or other suitable substances) before applying the resin glue during assembly. This pre-protection step ensures that the blind holes remain clear and accessible for inserting pin-shaped connection elements, while still allowing the resin to properly bond the printed circuits together.
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5b
AI summary
The present invention concerns a backplane electronic board (20) having an inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterised in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.