Mini LED Backplane Conductive Layout for Encapsulation Peeling Resistance
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Solution Overview
Problem
Mini LEDs in display products are prone to encapsulation peeling due to temperature changes, leading to operational failures and reduced service life.
Innovation Solution
A backplane design featuring a substrate with a circuit structure layer, a reflective layer with through holes, and encapsulation portions, where the conductive lines are strategically arranged to minimize stress concentration and enhance film adhesion, preventing peeling and breakage of conductive lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If Mini LEDs are used in display products, then high brightness and long service life are achieved, but encapsulation peeling occurs due to temperature changes
Solution Approach 1:
The conductive line is designed with different local structures: a first section with larger cross-sectional area for current carrying, and a second section with smaller cross-sectional area that avoids the stress concentration region at the encapsulation edge. This local quality differentiation allows the conductive line to maintain electrical functionality while avoiding the peeling zone, thereby resolving the contradiction between brightness (requiring adequate current) and encapsulation peeling resistance.
2Device complexity
If conductive lines are placed close to encapsulation portions for compact design, then device complexity is reduced, but stress concentration causes film adhesion weakness and peeling
Solution Approach 1:
The conductive line configuration transitions from a simple linear path to a multi-dimensional layout with varying cross-sectional areas and orientations. The second section of the conductive line is specifically oriented to avoid the radial stress distribution pattern around the encapsulation edge, utilizing spatial dimensionality to bypass the weak adhesion zone while maintaining electrical connectivity.
3Ease of manufacture
If conductive lines have uniform cross-sectional area for ease of manufacture, then manufacturing precision is improved, but stress concentration at encapsulation edges causes breakage
Solution Approach 1:
The conductive line is designed with non-uniform cross-sectional area: the first section has larger area for current carrying, while the second section has smaller area specifically where it approaches the encapsulation edge. This local quality variation is achieved through standard photolithography processes by adjusting pattern dimensions in different regions, maintaining ease of manufacture while preventing stress-induced breakage.
Data Source
AI summary
A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection. The first orthographic projection is located within the fourth orthographic projection, the second orthographic projection is partially overlapped with the fourth orthographic projection, and the third orthographic projection is located outside the fourth orthographic projection.