Backplane Connector Broadside Coupling Crosstalk Reduction
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Solution Overview
Problem
High-speed data transfer in backplane connectors leads to increased crosstalk and skew, necessitating shielding that raises costs and connector size, while eliminating shields compromises robustness and increases costs further.
Innovation Solution
A backplane connector design featuring a pin header with offset terminals and air channels for broadside coupling, paired with wafer connector components that utilize internal cavities and dielectric inserts to regulate impedance and reduce crosstalk, maintaining robustness without shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shields are added to backplane connectors for high-speed data transfer, then crosstalk and skew are reduced, but connector size and manufacturing cost increase
Solution Approach 1:
The patent removes the traditional shield structure from backplane connectors while maintaining signal integrity through alternative means. The shield element is extracted from the connector design, and its protective function is replaced by precise terminal geometry and positioning features that control electromagnetic fields without requiring physical shielding.
Solution Approach 2:
The patent applies local quality control through precisely engineered terminal features including specific contact blade geometries, positioning protrusions, and cavity structures. These localized structural characteristics control signal behavior and reduce crosstalk at specific interaction points rather than requiring global shielding across the entire connector.
2Reliability
If shields are added to backplane connectors for high-speed data transfer, then crosstalk and skew are reduced, but manufacturing cost increases
Solution Approach 1:
The patent removes the shield structure to eliminate the complex manufacturing process of forming, assembling, and integrating separate shield elements. This extraction simplifies the manufacturing workflow and reduces material costs while maintaining signal integrity through the terminal geometry-based approach.
Solution Approach 2:
The patent merges the signal transmission function and the electromagnetic field control function into a single integrated terminal structure. The terminal elements perform both electrical connection and signal integrity management, eliminating the need for separate shield components and reducing manufacturing complexity.
3Area of stationary object
If shields are eliminated from backplane connectors, then size and cost are reduced, but connector robustness decreases
Solution Approach 1:
The patent enhances local structural quality at the terminal contact points through precisely engineered geometries, positioning protrusions, and cavity structures. These localized features provide mechanical stability and signal integrity without requiring extensive shielding, achieving robustness through targeted structural optimization rather than global reinforcement.
Solution Approach 2:
The patent employs composite structural approaches combining conductive terminal materials with insulating housing materials in an integrated design. The terminal structures incorporate multiple material properties to achieve both electrical conductivity and mechanical robustness, replacing the need for shield-based protection with material-optimized terminal construction.
4Productivity
If terminal density is increased in backplane connectors, then data transfer capacity improves, but crosstalk between terminals increases
Solution Approach 1:
The patent applies local quality control at each terminal interface through specifically engineered contact blade geometries, positioning features, and cavity structures. These localized structural characteristics control electromagnetic field distribution between adjacent terminals, reducing crosstalk even at high terminal densities without requiring increased spacing that would reduce capacity.
Solution Approach 2:
The patent replaces traditional mechanical shielding structures with geometric field control through terminal design. The terminal geometries and positioning features create natural electromagnetic field containment and directionality, substituting physical barriers with field-shaping structures that reduce crosstalk through electromagnetic principle rather than mechanical separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high terminal density and low crosstalk with reduced size and cost, supporting high-speed data transfer while maintaining connector robustness and impedance control.
Implementation Method 1
the two columns defining a plurality of horizontal rows of terminals, each row including a pair of terminals, and preferably a pair of differential signal terminals. The terminals in each of the wafer connector component rows are aligned broadside together so that capacitive coupling may occur between the pairs in a broadside manner.
Data Source
AI summary
A high speed connector includes a plurality of wafer-style components, the wafers including two columns of conductive terminals that are supported in an insulative support body by a plurality of channels. Ribs may be provided to help secure one of the terminals in one of the plurality of channels. The two columns of terminals are configured to form broadside coupled terminal pairs and an air channel is at least partially disposed in the wafer between two adjacent broadside coupled terminal pairs.