Backplane Connector Shield Structure for High-Speed Crosstalk Isolation

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Solution Overview

Problem

Conventional backplane connectors in communication devices face excessive crosstalk noise, which cannot meet the high-speed electrical performance requirements for evolving communication products, especially at rates of 56 Gbps or higher.

Innovation Solution

A connector design featuring stacked lead frames with shield layers and end protectors that include conductive and shield structures to electromagnetically isolate connection terminal groups, reducing crosstalk through improved transmission paths and increased contact areas between shield structures and layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional backplane connector design is used, then device complexity is reduced, but crosstalk noise increases excessively

Engineering Contradiction:

Improvecrosstalk noiseVSAvoidconnector structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The connector is divided into multiple lead frames stacked in sequence, with each lead frame containing connection terminals and shield layers. This segmentation allows independent optimization of each layer for signal transmission and electromagnetic shielding, effectively reducing crosstalk between adjacent signal paths while maintaining manageable structural complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Shield layers are introduced as intermediary structures between adjacent connection terminal groups. These shield layers act as electromagnetic barriers that intercept and redirect electromagnetic fields, preventing crosstalk between neighboring signal pairs without requiring fundamental changes to the connector architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If shield layers and conductive structures are added to reduce crosstalk, then electromagnetic isolation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectromagnetic isolationVSAvoidconnector manufacturing

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The shield layers and conductive structures are integrated into the lead frame assembly process, where multiple lead frames with embedded shield layers are stacked and bonded together as a single unit. This merging approach allows simultaneous fabrication of multiple components, improving electromagnetic isolation while maintaining manufacturing efficiency through standardized assembly procedures.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If more shield structures and protrusions are added, then contact area between shield layer increases, but device complexity increases

Engineering Contradiction:

Improveelectrical connection effectVSAvoidshield structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Protrusions are added to the shield structures extending in the vertical dimension, creating multiple contact points with the shield layer. This dimensional extension significantly increases the contact area and improves electrical connection reliability without requiring lateral expansion or additional complex components, as the protrusions utilize the existing vertical space within the connector assembly.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly reduces crosstalk noise, improving communication effectiveness by enhancing electromagnetic isolation and signal transmission efficiency, meeting the requirements for 112 Gbps applications.

Implementation Method 1

Each lead frame includes a plurality of connection terminal groups and a shield layer. The shield layer is configured to electromagnetically isolate connection terminal groups in adjacent lead frames.

Methodology Applied

Scientific EffectElectromagnetic isolation: Faraday Cage

Implementation Method 2

The conductive structure is electrically connected to the corresponding shield layer of the connection terminal group, and is configured to transmit a loop signal corresponding to the signal.

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

the end protector further includes a shield structure that is configured to electromagnetically isolate two adjacent connection terminal groups in each lead frame

Methodology Applied

Scientific EffectElectromagnetic isolation: Faraday Cage

Data Source

PatentUS12548952B2Connector, functional board, and board-level architecture

Publication Date: 2026.02.10 HUAWEI TECH CO LTD

AI summary

A connector includes an end protector and lead frames. Each lead frame includes a plurality of connection terminal groups and a shield layer. Each connection terminal group includes two connection terminals configured to transmit a signal. Each connection terminal has a first connection end that cooperates with insertion of a circuit board. The shield layer is configured to electromagnetically isolate connection terminal groups in adjacent lead frames. An end protector includes a conductive structure that is located between the first connection ends of the two connection terminals in each connection terminal group. In the foregoing technical solution, with the conductive structure on the end protector, a transmission path of a loop signal corresponding to a differential signal transmitted by each connection terminal group is improved, crosstalk between loop signals corresponding to different connection terminal groups is reduced, and communication effect of the connector is improved.