Backplane Connector Heatsink Assembly for Active Device Cooling

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Solution Overview

Problem

Backplanes in computing systems face mechanical failure due to repetitive flexing of cables when expansion cards are added or removed, leading to reduced longevity, and there is a need for improved heat dissipation to enhance overall system reliability.

Innovation Solution

A connector assembly with a heatsink having a plurality of fins extending parallel to the connector board, creating a thermal path from the front side to the back side to dissipate heat generated by active devices, which can include optical or electrical connectors and active components like transceivers, using a thermal gap pad to reduce thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If cables are used to connect expansion cards to backplanes, then the system allows flexible card addition and removal, but repetitive flexing of cables leads to mechanical failure and reduced longevity

Engineering Contradiction:

Improveflexibility of card addition and removalVSAvoidlongevity of cable connections

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The invention extracts the cable from the connection system and replaces it with a rigid backplane connector assembly. The connector is directly mounted to the backplane board, eliminating the flexible cable portion that causes mechanical failure while maintaining the ability to add and remove expansion cards through the connector interface.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the connector with the backplane board by directly mounting the connector to the board. This integration eliminates the separate cable component, creating a more reliable fixed connection while preserving card hot-plug capability through the connector's design.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If active devices are connected to connectors on backplanes, then system functionality is enhanced, but heat generated by active devices accumulates and reduces system reliability

Engineering Contradiction:

Improvefunctionality of active devicesVSAvoidheat accumulation from active devices

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The invention introduces a thermal interface material as an intermediary between the active device and the backplane board. This material facilitates heat transfer from the active device through the connector assembly to the backplane, which acts as a heat sink, thereby managing thermal accumulation while preserving device functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention replaces passive thermal management with an active thermal conduction path. Instead of relying on natural convection or radiation, the design creates a direct thermal conduction pathway through the connector assembly and backplane board, efficiently transferring heat away from active devices.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If connectors are directly mounted to backplane boards, then cable-related mechanical failures are eliminated, but heat dissipation from active devices becomes more challenging

Engineering Contradiction:

Improveelimination of cable flexing failuresVSAvoidthermal management complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention makes the backplane board serve multiple functions: it provides the structural mounting surface for connectors and simultaneously acts as a heat sink for thermal management. This multi-functionality eliminates the need for separate cable assemblies while addressing both mechanical reliability and thermal dissipation through the board's inherent properties.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively extends the life expectancy of backplanes by preventing mechanical failure and efficiently dissipating heat, thereby improving the reliability and longevity of computing systems by reducing thermal resistance and facilitating heat escape through the fins of the heatsink.

Implementation Method 1

the heatsink comprising a plurality of fins extending parallel to the connector board for drawing heat through the connector from the front side to the back side of the connector board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the plurality of fins extending parallel to the connector board for drawing heat through the connector

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20240334590A1Heat dissipation from active devices connected to connectors

Publication Date: 2024.10.03 REFLEX PHOTONICS

AI summary

An assembly comprising a connector board having a front side and a back side, a connector mounted to the connector board, the connector having a mating end extending outwardly from the front side of the connector board, and a heatsink extending outwardly from the back side of the connector board and aligned with the connector, the heatsink comprising a plurality of fins extending parallel to the connector board for drawing heat through the connector from the front side to the back side of the connector board.