Backplane with Integrated Cooling Channels for Heat Dissipation
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Solution Overview
Problem
Conventional switch cabinets require extensive cabling for electrical connections, leading to increased effort and costs, and conductor tracks manufactured by 3D printing suffer from lower electrical conductivity, resulting in heat management issues due to higher heat development.
Innovation Solution
A backplane with integrated conductor tracks and cooling elements, such as cooling channels or finned heat sinks, manufactured using additive manufacturing methods like 3D printing, to facilitate efficient electrical connections and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductor tracks are manufactured using 3D printing, then manufacturing flexibility and integration are improved, but electrical conductivity decreases leading to heat management issues
Solution Approach 1:
The patent combines multiple functions into the backplane structure: electrical conduction through conductor tracks, cooling through integrated cooling channels, and structural support through the carrier plate. This merging allows the 3D printed backplane to compensate for lower electrical conductivity by integrating active cooling functionality directly into the electrical connection system.
Solution Approach 2:
The patent changes the physical parameters of the conductor tracks by varying their cross-sectional area, wall thickness, or material composition in different regions. This allows optimization of electrical conductivity in critical areas while maintaining manufacturing flexibility through additive production methods.
2Reliability
If extensive cabling is used for electrical connections, then connection reliability is improved, but cabling effort and costs increase
Solution Approach 1:
The patent merges the functions of electrical connection and structural support into a single integrated backplane system. Conductor tracks are directly formed on the carrier plate, eliminating the need for separate cables and connection hardware, thereby reducing device complexity while maintaining connection reliability through direct electrical pathways.
Solution Approach 2:
The backplane serves multiple functions simultaneously: it provides mechanical support for electrical components, establishes electrical connections through integrated conductor tracks, and manages heat dissipation through cooling channels. This multi-functionality eliminates the need for separate cabling systems.
3Temperature
If cooling elements are integrated on conductor tracks, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The cooling elements are merged with the conductor track structure, forming an integrated thermal management system. The cooling channels are positioned directly adjacent to or around the conductor tracks, allowing heat to be dissipated at the source without requiring separate cooling systems or complex thermal pathways.
Solution Approach 2:
Cooling elements are selectively integrated only in regions where heat dissipation is required, such as near high-current conductor tracks or power-consuming components. This localized approach provides effective heat management while minimizing the overall structural complexity of the backplane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces cabling efforts and costs while effectively dissipating heat from conductor tracks, preventing overheating and improving the reliability of electrical connections within switch cabinets.
Implementation Method 1
at least one cooling element arranged on a conductor track for cooling the conductor track
Implementation Method 2
at least one cooling element arranged on a conductor track for cooling the conductor track
Implementation Method 3
the conductor tracks and the at least one cooling element are manufactured using an additive manufacturing method, for example using 3D printing
Data Source
AI summary
A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.