LED Backplane Curved Optical Structures to Cut Total Reflection
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Solution Overview
Problem
Conventional backplane designs for display devices have low light extraction efficiency due to flat light exit surfaces of encapsulating adhesives, leading to high power consumption and production costs, and difficulty in forming convex lens structures for optical structures.
Innovation Solution
A backplane design featuring a substrate with a first reflective layer having through holes for light-emitting diode chips, where the optical structures have curved light exit surfaces and are formed using a dispensing process with materials like transparent colloidal materials and fumed silica, enhancing light extraction efficiency and reducing adhesive usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flat light exit surfaces of encapsulating adhesives are used in conventional backplane designs, then the structure is simple and easy to manufacture, but light extraction efficiency is low leading to high power consumption
Solution Approach 1:
The patent applies curvature by forming convex lens structures on the light exit surfaces of the encapsulating adhesives. These curved surfaces replace the conventional flat surfaces, enabling better light extraction through reduced total internal reflection and improved light directionality, thereby lowering power consumption while maintaining manufacturing feasibility through the dispensing process
Solution Approach 2:
The patent changes the surface geometry parameter from flat to curved by controlling the curing process of the encapsulating adhesive. The convex lens shape is achieved by adjusting dispensing parameters and curing conditions, transforming the physical state and surface morphology of the adhesive to optimize light extraction efficiency
2Productivity
If convex lens structures are formed for optical structures, then light extraction efficiency is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent employs self-service by utilizing the self-aligning and self-leveling properties of the encapsulating adhesive during the dispensing and curing process. The adhesive automatically forms uniform convex lens structures on the LED chips without requiring complex external molding tools or multiple manufacturing steps, thereby achieving high light extraction efficiency while maintaining ease of manufacture
Solution Approach 2:
The patent replaces complex mechanical molding systems with a chemical-based dispensing and curing process. Instead of using mechanical lenses or complex assembly steps, the encapsulating adhesive is dispensed and cured to form the optical structures, substituting mechanical complexity with a simpler chemical process
3Loss of energy
If conventional backplane designs are used, then production costs are high, but light extraction efficiency is low
Solution Approach 1:
The patent extracts and eliminates the need for separate, expensive optical components by integrating the optical functions directly into the encapsulating adhesive layer. The convex lens structures are formed within the adhesive itself, removing the need for additional optical elements and reducing material costs while improving light extraction efficiency
Solution Approach 2:
The encapsulating adhesive serves multiple functions simultaneously: it provides electrical insulation, mechanical protection, and optical enhancement through the convex lens structures. This multi-functionality eliminates the need for separate components for each function, reducing overall production costs while achieving high light extraction efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction efficiency by reducing total reflection and increasing the amount of light exiting the backplane, while also reducing production costs and enhancing the stability of optical structures.
Implementation Method 1
improves light extraction efficiency by reducing total reflection and increasing the amount of light exiting the backplane
Implementation Method 2
The first reflective layer is disposed on a bearing surface of the substrate
Data Source
AI summary
A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.