Backplane Gap Filling via Photopolymerization
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Solution Overview
Problem
The conventional manufacturing process for backplanes in segment displays is costly, complex, and has a low yield due to the need for multiple steps, including drilling, electroless plating, electroplating, and gap-plugging, which results in deep gaps that can be detrimental to the display panel, especially those using microcup technology.
Innovation Solution
A new gap plugging process using a radiation or thermal curable material with a high solid content and controlled viscosity is applied to fill gaps between segment electrodes, eliminating the need for photoimageable materials and brushing, and allowing for precise lamination to create a planar surface without protrusions, reducing the depth of gaps and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing process (drilling, electroless plating, electroplating, gap-plugging) is used, then backplane can be manufactured with segment electrodes, but the process is costly, complex, and has low yield due to multiple steps creating deep gaps
Solution Approach 1:
The patent removes the complex multi-step conventional manufacturing process (drilling, electroless plating, electroplating, gap-plugging) and replaces it with a simplified direct imaging process that directly forms the conductive pattern on the backplane substrate, extracting only the essential function of creating conductive segments without the cumbersome intermediate steps
Solution Approach 2:
The patent replaces mechanical and chemical manufacturing steps (drilling, plating, brushing) with a photopolymerization-based direct imaging system that uses light to cure liquid resin in desired patterns, substituting complex mechanical/chemical processes with a simpler optical-chemical process
2Manufacturing precision
If conventional gap-plugging process is used, then gaps between segment electrodes are filled, but deep gaps are created that are detrimental to display panels, especially microcup technology
Solution Approach 1:
The patent applies a release film to the backplane surface before applying the liquid resin, creating a preliminary protective layer that prevents the resin from adhering to the surface and allows for easy removal after curing, ensuring that the cured resin sits within the gaps without creating protrusions that would affect display panel performance
3Manufacturing precision
If photoimageable materials and brushing steps are used, then gaps can be filled, but the process becomes more complex and costly
Solution Approach 1:
The patent uses a liquid resin that self-levels and self-cures through photopolymerization when exposed to UV light, eliminating the need for manual brushing steps. The resin automatically fills gaps and cures in place, with the release film enabling easy removal without requiring mechanical brushing or additional processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process reduces the complexity and cost of backplane manufacturing, eliminates the need for cumbersome steps like photolithography and brushing, and achieves a significant reduction in gap depth, enhancing the compatibility with display panels, particularly those using microcup technology.
Implementation Method 1
radiation or thermal curable material
Implementation Method 2
radiation or thermal curable material
Data Source
AI summary
The present invention relates to design and processes for the manufacture of backplane for segment displays. The process comprises: a) forming conductive lines on a non-conductive substrate layer; b) covering the conductive lines with a photoimageable material; c) forming conductive areas connected to the conductive lines and embedded in the photoimageable material; d) plating a conductive material over the photoimageable material to form segment electrodes; and e) optionally filling gaps between said segment electrodes with a thermal or radiation curable material followed by hardening said thermal or radiation curable material.