Backplane With Integrated Shielding For Control Cabinets
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Solution Overview
Problem
Conventional methods for connecting electrical components in control cabinets require extensive cabling, leading to high cabling effort, increased material costs, and space requirements, and additional shielding measures complicate the process.
Innovation Solution
A backplane with integrated shielding, produced using 3D printing, which incorporates conductive materials like graphene or carbon nanotubes to shield electrical and magnetic fields, reducing the need for external shielding components and allowing for precise adaptation of shielding geometries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cabling methods are used to connect electrical components in control cabinets, then electrical connections can be established, but cabling effort, material costs, and space requirements increase significantly
Solution Approach 1:
The patent merges the functions of electrical connection and signal transmission into a single backplane structure. Electrical components are directly mounted on the backplane and connected through integrated conductive traces, eliminating the need for separate cables and connectors. This consolidation reduces cabling complexity while maintaining reliable electrical connections between components.
Solution Approach 2:
The backplane serves multiple functions simultaneously: it provides mechanical support for electrical components, establishes electrical connections through integrated conductors, and provides electromagnetic shielding. This multi-functionality eliminates the need for separate cabling systems and external shielding components, reducing overall device complexity.
2Object-affected harmful factors
If additional shielding components are installed to protect against electromagnetic interference, then shielding effectiveness is improved, but production complexity and costs increase
Solution Approach 1:
The shielding function is merged into the backplane structure itself. Conductive shielding layers are integrated directly into the backplane during manufacturing, eliminating the need for separate shielding components and their associated installation steps. This reduces production complexity while maintaining effective electromagnetic shielding.
Solution Approach 2:
The backplane utilizes composite material structures with conductive layers embedded within insulating materials. This integration of different material properties (conductive for shielding, insulating for electrical isolation) within a single component achieves effective electromagnetic protection without requiring multiple separate parts.
3Object-affected harmful factors
If separate shielding components are used to shield electrical conductors, then electromagnetic shielding is achieved, but space requirements and material costs increase
Solution Approach 1:
The shielding function is combined with the backplane structure, eliminating the need for external shielding components. The conductive shielding layers are embedded within the backplane itself, providing electromagnetic protection without occupying additional space outside the backplane volume.
Solution Approach 2:
The shielding layers are nested within the backplane structure, with conductive layers positioned between the front and rear surfaces of the backplane. This nesting approach provides effective shielding while utilizing the existing backplane volume, avoiding additional space requirements.
4Reliability
If conventional mounting methods are used for electrical components, then components can be installed, but production effort and assembly time increase
Solution Approach 1:
The backplane integrates mounting structures, electrical connections, and shielding into a single pre-assembled unit. Electrical components are mounted directly on the backplane with connections already established through integrated conductors, eliminating separate connection steps and improving production efficiency while maintaining reliable connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production effort, costs, and space requirements by integrating shielding directly into the backplane, enhancing electrical and magnetic shielding while improving heat dissipation, and simplifying the connection of electrical components within the control cabinet.
Implementation Method 1
The backplane is manufactured using a 3D print, which produces the carrier plate 3, the electrical conductors 5 and the at least one shield 7 integrated into the carrier plate 3
Implementation Method 2
each shield is made of an electrically and/or magnetically conductive material... at least one shield is made of graphene, and/or at least one shield is made of carbon nanotubes
Implementation Method 3
at least one shield integrated into the carrier plate for shielding against electric and/or magnetic fields
Implementation Method 4
at least one shield is made of a plastic filled with carbon nanotubes... exhibit very good shielding properties and also very good thermal conductivities, and can thus, in addition to shielding electric and/or magnetic fields, also serve to improve heat dissipation
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a backplane (1) for electrically connecting electrical components and a method for manufacturing it. The backplane (1) comprises a carrier plate (3), electrical conductors (5) arranged on and/or in the carrier plate (3), and at least one shield (7) integrated into the carrier plate (3) for shielding electric and/or magnetic fields.