Driving Backplane Mark Layout for Faster Micro-LED Position Inspection
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Solution Overview
Problem
The existing manufacturing process of micro light-emitting diode (LED) or submillimeter LED light panels is time-consuming and inefficient due to the need for multiple processes such as die bonding, automated optical inspection, reworking, and bonding, which require frequent loading and unloading of the driving backplane and chips on die bonders and automated optical inspection instruments.
Innovation Solution
A driving backplane is designed with a substrate, pad groups, and marks, where the pad groups and marks are positioned on the same side of the substrate without overlap. The pad groups correspond to one or more marks, and the marks are arranged to be adjacent to the orthogonal projection of the pad group on the substrate, with a gap from it. This configuration allows for improved optical inspection and reduced time in detecting position accuracy without the need for frequent loading and unloading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple processes (die bonding, automated optical inspection, reworking, bonding) are used in the manufacturing process, then the manufacturing precision and reliability are improved, but the production time increases and productivity decreases
Solution Approach 1:
The patent combines the mark structure with the pad group structure by positioning marks adjacent to pad groups on the same side of the substrate without overlapping. This integration allows the optical inspection system to detect position accuracy of multiple chips simultaneously during the die bonding process, eliminating the need for separate automated optical inspection processes and reducing frequent loading/unloading operations.
Solution Approach 2:
The marks are pre-positioned on the substrate adjacent to each pad group before the die bonding process begins. This preliminary arrangement enables the optical inspection system to directly detect position accuracy during bonding without requiring additional inspection steps, thereby improving productivity while maintaining manufacturing precision.
2Measurement precision
If frequent loading and unloading of driving backplane and chips on die bonders and automated optical inspection instruments is performed, then the position accuracy detection is comprehensive, but the production time increases
Solution Approach 1:
By integrating marks with pad groups and positioning them on the same side of the substrate, the patent enables the optical inspection system to detect position accuracy of multiple chips simultaneously during the die bonding process. This eliminates the need for separate automated optical inspection processes and reduces frequent loading/unloading operations, thereby reducing detection time while maintaining comprehensive position accuracy measurement.
Solution Approach 2:
The mark structure serves multiple functions: it acts as both a reference for pad group positioning and as a target for optical inspection. This multi-functionality allows the same structure to be used for both alignment purposes and quality inspection, eliminating the need for separate inspection processes and reducing detection time.
3Device complexity
If marks are positioned overlapping with pad groups on the substrate, then the device complexity is reduced, but the optical inspection accuracy deteriorates
Solution Approach 1:
The patent positions marks adjacent to pad groups on the same side of the substrate without overlapping, creating distinct functional zones. The marks serve as optical inspection targets while pad groups serve as bonding targets. This spatial separation ensures that optical inspection accuracy is not compromised while maintaining relatively simple device structure.
Data Source
AI summary
A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.