Backplane Connector Shield Bumps for Signal Pair Impedance Tuning
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Solution Overview
Problem
Existing backplane connectors face challenges in adjusting the impedance of signal terminals to improve signal transmission quality.
Innovation Solution
A terminal module and backplane connector design featuring a metal shield surrounding member with protruding bump portions that adjust impedance by suppressing signal terminal impedance when separated from the contact portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional backplane connector structure is used, then the structure is simple and easy to manufacture, but the impedance of signal terminals cannot be adjusted, resulting in poor signal transmission quality
Solution Approach 1:
The metal shield surrounding member is provided with bump portions at specific locations where impedance adjustment is needed. These bump portions locally modify the electromagnetic field distribution around the signal terminals, achieving impedance control only where necessary rather than redesigning the entire connector structure.
Solution Approach 2:
The bump portions act as intermediary structures between the metal shield surrounding member and the signal terminals. They mediate the electromagnetic field interaction, allowing impedance adjustment without direct modification of the signal terminals themselves, thus maintaining manufacturing simplicity while achieving precision.
2Reliability
If the metal shield surrounding member is added to adjust impedance, then signal transmission quality is improved, but the device complexity increases
Solution Approach 1:
The metal shield surrounding member serves multiple functions: it provides electromagnetic shielding for the signal terminals and simultaneously acts as an impedance adjustment structure through its bump portions. This multi-functionality improves signal transmission quality without adding separate dedicated impedance adjustment components, thus limiting the increase in device complexity.
Solution Approach 2:
The impedance adjustment function is merged with the electromagnetic shielding function by integrating the bump portions directly into the metal shield surrounding member. This combination eliminates the need for separate impedance adjustment mechanisms, improving reliability while keeping the structural complexity increase minimal.
Data Source
AI summary
A terminal module includes a number of conductive terminals, an insulating block and a metal shield surrounding member. The conductive terminal includes a contact portion. The insulating block is sleeved on the contact portion. The metal shield surrounding member is sleeved on the insulating block. The metal shield surrounding member includes an inner cavity. The insulating block is at least partially received in the inner cavity. The metal shield surrounding member is provided with at least one bump portion protruding into the inner cavity. The bump portion is configured to adjust the impedance of a signal terminal pair.