Backplane Signal Pair Element with Insulative Frame and Ground Shield
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Solution Overview
Problem
Existing backplane connectors with waferized structures are costly to tool and difficult to adapt for complex wiring schemes, requiring multiple sets of tooling for different pair counts and leading to increased labor and time for repairs due to the need to replace entire wafers when a single pair is defective.
Innovation Solution
The use of individual signal pair elements, or 'chicklets,' which integrate signal terminals and ground planes, allowing for modification of connector housings to accommodate various pair arrangements, reducing tooling costs and enabling easier support of complex wiring patterns by allowing only the defective pair to be replaced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If waferized structures are used in backplane connectors, then signal transmission function is achieved, but tooling cost increases significantly
Solution Approach 1:
The waferized structure is divided into separate signal pair elements (chicklets) that can be independently manufactured and assembled. Each chicklet contains individual signal terminals and ground planes that are separately formed then integrated into the connector housing, eliminating the need for expensive multi-pair wafer tooling while maintaining signal transmission functionality.
2Adaptability or versatility
If multiple sets of tooling are used for different pair count wafers, then various connector configurations can be produced, but manufacturing cost and complexity increase
Solution Approach 1:
A single standardized chicklet design with universal dimensions and mounting features can be used across multiple connector configurations. The same chicklet can be accommodated in various pair count arrangements (3-pair, 4-pair, 5-pair, etc.) by simply changing the housing layout, eliminating the need for different tooling sets for each configuration.
3Reliability
If entire wafer is replaced when single pair is defective, then connection reliability is maintained, but repair time and material loss increase
Solution Approach 1:
The connector is segmented into individually replaceable chicklets, each handling a specific signal pair. When a defect occurs in one pair, only that specific chicklet needs to be replaced rather than the entire wafer assembly, significantly reducing repair time and material waste while maintaining overall connection reliability through the modular architecture.
4Reliability
If waferized structures are used, then signal pair support is achieved, but support for complex wiring schemes becomes difficult
Solution Approach 1:
The connector design allows dynamic reconfiguration of wiring schemes by arranging chicklets in different patterns within the housing. Complex wiring schemes such as lettered configurations (W, X, Y) can be implemented by simply repositioning identical chicklet components rather than requiring specialized wafer tooling for each wiring pattern, providing flexibility to adapt to various wiring requirements.
Data Source
AI summary
Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires can be terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.