Backplane Staging for Microdevice Integration Yield
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Solution Overview
Problem
The challenge lies in effectively integrating millions of microdevices, such as micro LEDs and MEMS, with circuits on a substrate while maintaining proper yield and mechanical stability, particularly in ensuring reliable connections and minimizing interference during the transfer process.
Innovation Solution
The integration involves a substrate with pads that provide mechanical and electrical connections, using a buffer layer for delamination and a stacked structure of conductive and dielectric layers to support microdevices, along with light reflectors and color conversion layers for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If millions of microdevices are transferred and integrated with circuits on a substrate, then system performance and functionality are improved, but manufacturing complexity and difficulty of integration increase
Solution Approach 1:
The integration process is divided into distinct stages: microdevice fabrication on a first substrate, transfer to a second substrate, and final integration with circuits. This segmentation allows each stage to be optimized independently, managing the complexity of integrating millions of microdevices while achieving high system performance
Solution Approach 2:
Microdevices are pre-fabricated and tested on a first substrate before transfer to the final substrate. This preliminary action ensures device quality and functionality are established before the complex integration process, reducing manufacturing complexity while maintaining system performance
2Reliability
If microdevices are transferred to a substrate with pads for connection, then electrical and mechanical connections are improved, but interference during transfer process increases
Solution Approach 1:
A second substrate with pads is introduced as an intermediary platform to receive transferred microdevices before final integration with circuits. This intermediary substrate provides stable mechanical and electrical connections while isolating the transfer process from potential interference with the final circuit integration
Solution Approach 2:
The connection function is extracted and implemented on the second substrate through dedicated pads, separating the connection establishment from the transfer process. This extraction allows connections to be formed in a controlled manner, improving reliability while minimizing transfer interference
3Stability of the object's composition
If stacked structure of conductive and dielectric layers is used to support microdevices, then mechanical stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The stacked structure of conductive and dielectric layers is fabricated on the second substrate as a separate component before microdevice transfer. This segmentation allows the stacked structure to be manufactured with precise layer alignment on the substrate, then used as a stable mechanical support during transfer, achieving both mechanical stability and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable and efficient integration of microdevices with circuits, improving system performance by ensuring reliable connections and minimizing interference, thus achieving high yield and mechanical stability.
Implementation Method 1
using a buffer layer for delamination
Implementation Method 2
light reflectors for enhanced performance
Implementation Method 3
color conversion layers for enhanced performance
Data Source
AI summary
This disclosure is related to arranging to a system comprising of backplane and micro-devices. The backplane components layers may comprise of multiple conductive layers and multiple dielectric or semiconductor layers. The system is a stacked structure The stacking structure can be used with different types of transistors and backplane including but not limited to staggered, inverted staggered, and other types In addition, touch sensing structure can be integrated into the system.