Three-Dimensional Backplane Vertical Insertion Plates
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Solution Overview
Problem
Conventional backplane architectures face challenges with increasing size and layer density, leading to manufacturing difficulties, low yield, and high costs due to the need for larger, more complex PCB designs to accommodate higher switching capacities.
Innovation Solution
A three-dimensional backplane structure is formed using multiple vertical insertion plates with connectors for signal interconnection between service and switch boards, distributing switching planes across multiple wiring planes to reduce layer count and size, thereby simplifying manufacturing and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the density of physical interface and number of service board are increased to achieve large-scale service switching, then the switching capacity of backplane is improved, but the PCB wiring scale, number of layers and size become excessively large, reaching processing limits
Solution Approach 1:
The backplane is divided into multiple independent vertical insertion plates, each serving as a separate wiring plane. This segmentation distributes the switching planes across multiple smaller PCB structures, reducing the overall complexity and layer count of any single PCB while maintaining large-scale switching capacity through the collective arrangement of multiple plates.
Solution Approach 2:
The invention transitions from a conventional two-dimensional PCB layout to a three-dimensional structure using vertical insertion plates. By utilizing the vertical dimension and creating orthogonal arrangements between switch boards and service boards, the design achieves higher switching capacity without proportionally increasing PCB wiring scale and layer count.
2Power
If the size of backplane is increased to accommodate more service boards, then the switching capacity is improved, but the manufacturing difficulty increases, yield decreases and cost increases
Solution Approach 1:
The backplane is divided into multiple independent vertical insertion plates, each serving as a separate wiring plane. This segmentation distributes the switching planes across multiple smaller PCB structures, reducing the overall complexity and layer count of any single PCB while maintaining large-scale switching capacity through the collective arrangement of multiple plates.
Solution Approach 2:
The invention transitions from a conventional two-dimensional PCB layout to a three-dimensional structure using vertical insertion plates. By utilizing the vertical dimension and creating orthogonal arrangements between switch boards and service boards, the design achieves higher switching capacity without proportionally increasing PCB wiring scale and layer count.
Data Source
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AI summary
Embodiments of the present invention provide a backplane, a communication device and a communication system, which belong to the field of communications technologies. The backplane includes multiple vertical insertion plates separately arranged from each other, and connectors connecting circuit boards and a circuit serving as signal wiring are disposed on the vertical insertion plate. The connector is electronically connected to the circuit of the vertical insertion plate on which the connector is disposed, so that when the connector on the vertical insertion plate connects a switch board with a service board, the switch board and the service board can implement signal interconnection through the signal wiring of the vertical insertion plate. Due to the backplane of a three-dimensional structure, the processing difficulty of the backplane is greatly lowered, the cost is greatly reduced, thus solving the problem of excessively large number of layers and excessively large size, which is caused by large-scale backplane wiring. Therefore the backplane design and the switching capacity of a communication device are not limited by the processing capability of a PCB, thereby ensuring implementability of capacity expansion of a communication device in engineering.