Backplane Via Pattern for High-Density Connector Crosstalk Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density, high-speed electrical connectors face performance issues such as crosstalk and impedance variations due to increased signal conductor density and operating frequencies, which current connector designs struggle to address effectively.
Innovation Solution
The implementation of a printed circuit board structure with specific via patterns, including signal vias, ground vias, ground shadow vias, and non-plated holes, optimized in terms of diameter and plating to improve electrical performance by reducing interference and maintaining desired impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical conductors are placed closer together to increase density, then the number of circuits per area increases, but electrical interference and crosstalk between adjacent conductors worsen
Solution Approach 1:
Ground conductors are inserted as intermediary elements between adjacent signal conductors. These ground conductors act as mediators that intercept and divert electromagnetic interference, preventing crosstalk between signal conductors while allowing the conductors to remain in close proximity for high density
Solution Approach 2:
The patent modifies the electrical parameters of the connector by introducing ground conductors with specific impedance characteristics (50 ohm single-ended or 100 ohm differential) that are engineered to counterbalance the capacitive and inductive coupling between adjacent signal conductors, thereby maintaining signal integrity at high densities
2Object-affected harmful factors
If shield members are placed between signal conductors to reduce interference, then crosstalk is reduced, but the impedance of conductors is affected and device complexity increases
Solution Approach 1:
The ground conductors are designed with uniform impedance characteristics that match the signal conductors (50 ohm single-ended or 100 ohm differential), creating a homogeneous electromagnetic environment that consistently shields all signal pairs without introducing impedance mismatches or requiring complex variable shielding structures
3Adaptability or versatility
If more circuits are integrated into a given area to increase functionality, then system capability improves, but manufacturing precision requirements increase
Solution Approach 1:
The connector is segmented into modular units with repeating patterns of signal-conductor-ground-signal sequences. This segmentation allows for standardized manufacturing processes and fixture designs that can accurately position multiple conductors through repetitive positioning, reducing the overall manufacturing precision burden while enabling high circuit density
Data Source
AI summary
A printed circuit board includes: a plurality of layers including attachment layers and routing layers; and via patterns formed in one or more of the plurality of layers, each of the via patterns including: first and second signal vias configured to accept contact tails of signal conductors of a connector; ground vias configured to accept contact tails of ground conductors of the connector; ground shadow vias located adjacent to each of the first and second signal vias; and non-plated holes located between each of the ground shadow vias and the signal vias. Different layers of the plurality of layers may have different antipad configurations.