Backplane Connector Wafer Assemblies with C-Shaped Ground Shields
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Solution Overview
Problem
Current backplane connector systems face challenges in achieving high-speed operations while maintaining high pin densities and minimizing signal interference, such as crosstalk noise, due to the increasing complexity and density of electronic components.
Innovation Solution
The development of high-speed backplane connector systems that incorporate wafer assemblies with specific geometries and ground structures, including C-shaped ground shields and ground tabs, to encapsulate electrical connector pairs in a three-dimensional manner, along with dielectric fillers, which prevent undesirable mode propagation and ensure consistent impedance profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the spacing between electrical terminals is reduced to increase pin density, then the number of electrical terminals per unit area increases, but signal interference such as crosstalk noise increases
Solution Approach 1:
Ground shields are introduced as intermediary structures between adjacent electrical terminals. These ground shields act as mediators that block electromagnetic field coupling between neighboring signals, thereby reducing crosstalk noise while allowing high pin density to be maintained in the backplane connector system.
Solution Approach 2:
The patent applies different structural characteristics to different regions of the connector. Specifically, ground shields are selectively positioned between certain terminal pairs, and the housing structure incorporates varied thickness and material properties in different areas to optimize signal isolation locally where crosstalk is most problematic, while maintaining overall high pin density.
2Quantity of substance
If the number of electrical terminals is increased to fit more components, then the connector capacity increases, but signal integrity deteriorates due to increased interference
Solution Approach 1:
Ground shields serve as intermediary structures that partition the connector into isolated signal zones. This mediation allows a large number of electrical terminals to be packed closely together while maintaining signal integrity, as the ground shields prevent electromagnetic interference between adjacent signal pairs.
Solution Approach 2:
The patent extends the shielding approach into the three-dimensional structure of the connector housing. By incorporating ground shields that extend through the housing thickness and utilizing vertical spacing between terminal layers, the solution adds dimensional separation to reduce interference, enabling high terminal counts without compromising signal integrity.
3Object-affected harmful factors
If ground shields are added to reduce crosstalk, then signal interference decreases, but device complexity increases
Solution Approach 1:
The ground shields are merged with the connector housing structure itself, rather than being separate add-on components. The housing is designed to incorporate the ground shields as integral parts, combining the structural support function with the electromagnetic shielding function into a single unified structure, thereby reducing overall device complexity.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical support for the terminals, defines the connector geometry, and incorporates ground shields for electromagnetic shielding. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving crosstalk reduction.
Data Source
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AI summary
An electrical connector system for mounting a substrate comprises a plurality of wafer assemblies. Each wafer assembly comprises a first housing defining a plurality of first electrical contact channels, a first array of electrical contacts positioned within the plurality of first electrical contact channels, a second housing configured to mate with the first housing, the second housing defining a plurality of second electrical contact channels, a second array of electrical contacts positioned within the plurality of second electrical contact channels, and an organizer (366) positioned at the mounting end of the plurality of wafer assemblies. The first housing defines a plurality of projections (376) extending from an edge of the first housing at a mounting end of the wafer assembly, and the second housing defines a plurality of projections (376) extending from an edge of the second housing at the mounting end of the wafer assembly. Each electrical contact of the first array of electrical contacts defines a signal substrate engagement element extending past the edge of the first housing at the mounting end of the wafer assembly, and each electrical contact of the second array of electrical contacts defines a substrate engagement element extending past an edge of the second housing at the mounting end of the wafer assembly. The organizer (366) defines a first plurality of apertures (372) dimensioned to allow the signal substrate engagement elements (322) of the first and second arrays of electrical contacts to pass through the organizer (366) and extend away from the organizer, and a second plurality of apertures (375) dimensioned to allow the projections (376) extending from the first and second housings to pass through the organizer (366).