Condenser Microphone Backplate Assembly Manufacturing

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Solution Overview

Problem

The existing process for producing condenser microphone backplate assemblies is complex, error-prone, and costly, with multiple stages increasing the risk of distortion in the plastic mount, affecting the spacing between the backplate and diaphragm and degrading the quality of the electrical signal.

Innovation Solution

A backplate assembly with a plate having opposing planar surfaces and laterally extending tabs for electrical connectors, integrated with a mount formed from an electrically insulating material, manufactured using a single milling operation followed by moulding, eliminating the need for additional machining stages that can distort the mount.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If multiple milling and tapping stages are used to produce the backplate assembly, then the manufacturing process can be completed, but the plastic mount becomes distorted and the spacing between backplate and diaphragm is affected

Engineering Contradiction:
Improvemanufacturing process completionVSAvoidmount distortion and spacing consistency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent performs the milling of the plate and fabrication of apertures before the plastic mount is moulded and attached. By completing all machining operations on the metal plate prior to mounting the plastic components, the process eliminates subsequent machining that would distort the plastic mount, thereby maintaining manufacturing precision while completing the manufacturing process

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If multiple machining stages are performed, then the backplate assembly can be fully manufactured, but the number of process stages increases complexity and cost

Engineering Contradiction:
Improvebackplate assembly productionVSAvoidnumber of process stages
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent divides the manufacturing process into distinct sequential stages: first machining the metal plate components, then separately moulding and attaching the plastic mount. This segmentation allows each component to be manufactured using the most appropriate process for that material, reducing overall complexity compared to attempting to machine all features after assembly

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

All machining operations on the metal plate are performed before the plastic mount is attached. This preliminary action consolidates the number of machining stages required and eliminates the need for subsequent machining operations that would add complexity to the overall process

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If additional machining stages are used to create apertures and features, then the backplate can be fully functional, but the quality of electrical signal is degraded

Engineering Contradiction:
Improvebackplate functionalityVSAvoidelectrical signal quality
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent performs all machining operations including the fabrication of apertures for electrical connectors before the plastic mount is attached. This ensures that no subsequent machining distorts the plastic mount or affects the spacing between the backplate and diaphragm, thereby maintaining consistent capacitance and preserving electrical signal quality while still providing full backplate functionality

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the production process, reduces the risk of distortion, and maintains consistent spacing between the backplate and diaphragm, thereby improving the quality of the electrical signal by minimizing low-frequency losses.

Implementation Method 1

a mount affixed around at least a portion of the peripheral region... the mount adapted to connect the disc to a capsule assembly and insulate the disc from the diaphragm

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

The backplate and diaphragm are connected to electrical connectors and act as opposing plates of a capacitor, having a capacitance directly proportional to the size and spacing of the diaphragm and backplate. When the diaphragm is vibrated due to sound waves, it moves towards and away from the backplate, varying the spacing between the diaphragm and the backplate and causing a change in capacitance.

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS9549236B2Condenser microphone capsule backplate
Publication Date: 2017.01.17 FREEDMAN ELECTRONICS PTY LTD
  • US9549236B2 patent drawing
  • US9549236B2 patent drawing
  • US9549236B2 patent drawing

AI summary

An assembly for a condenser microphone capsule, the assembly comprising: a plate having opposing planar surfaces and one or more tabs extending laterally from a peripheral region, at least one tab being adapted to receive an electrical connector; and a mount affixed around at least a portion of the peripheral region.