Processor Back-Plate Bracket for Cooling and Circuit Access
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Solution Overview
Problem
Existing computing device enclosures face challenges in efficiently dissipating heat generated by processors and other components, particularly when access to electrical circuits is required for maintenance or updates, without compromising operational stability and security.
Innovation Solution
The use of processor back-plate devices with integrated brackets and locking mechanisms that cover apertures in the enclosure, incorporating thermal barriers and heat sinks to manage heat dissipation while allowing access to electrical circuits for maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If apertures are provided in the enclosure bracket for accessing electrical circuits, then maintenance and updates become easier, but heat dissipation efficiency deteriorates and structural security is compromised
Solution Approach 1:
The bracket is divided into multiple sections: solid portions for heat dissipation, aperture portions for access, and thermal barrier portions with heat sinks. This segmentation allows each region to perform its specialized function without interfering with others.
Solution Approach 2:
A thermal barrier portion with integrated heat sink acts as an intermediary element between the aperture and the electrical circuit. It blocks direct heat transfer to the circuit while still allowing maintenance access through the aperture.
2Strength
If a solid enclosure bracket is used for structural security, then structural integrity is improved, but access to electrical circuits for maintenance becomes difficult
Solution Approach 1:
The bracket exhibits local quality variations: solid portions provide structural strength, while aperture portions provide access. Each local region has optimized properties for its specific function rather than the entire bracket being uniformly solid or hollow.
3Temperature
If heat sinks are integrated into the bracket, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The thermal barrier portion and heat sink are merged into a single integrated component of the bracket. This combines the structural support function with the thermal management function in one element, reducing the need for separate heat sink components.
Solution Approach 2:
The bracket serves multiple functions simultaneously: structural support, heat dissipation, and maintenance access. The thermal barrier portion with heat sink provides both structural integrity and thermal management in a single element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by directing heat away from critical components, maintains operational stability, and facilitates easy access for maintenance and updates without compromising structural integrity.
Implementation Method 1
incorporating thermal barriers and heat sinks to manage heat dissipation
Implementation Method 2
incorporating thermal barriers and heat sinks to manage heat dissipation
Data Source
AI summary
In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.