Backplate Interconnect with Integrated Passives for Compact Sealed Packages
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Solution Overview
Problem
Current packaging technologies for electromechanical systems, such as microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), face challenges in creating sealed and compact packages that allow for efficient electrical connections between internal integrated circuits and external components while maintaining a hermetic seal.
Innovation Solution
The development of a dual substrate packaging device with a recessed backplate and substrate configuration, where electrical traces are formed on the backplate and integrated circuits are mounted within the recess, allowing connections to be made through conductive pads and seals that include metal-to-metal or epoxy seals, enabling a sealed area with external connections via conductive traces that traverse the seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hermetic seal is implemented to protect internal integrated circuits, then reliability is improved, but the seal width increases reducing available space for electronic components
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: a sealed area containing the electromechanical device and an unsealed area containing the recessed backplate with electronic components. The seal circumscribes only the sealed area, allowing the unsealed area to provide additional space for mounting integrated circuits without increasing the overall seal width.
2Ease of operation
If electrical connections are made through the seal, then connectivity between internal and external components is achieved, but the seal integrity is compromised
Solution Approach 1:
Conductive traces are introduced as intermediary elements that extend from the sealed area through the seal to the unsealed area. These traces provide the electrical connection pathway without requiring the seal itself to be discontinuous, maintaining seal integrity while enabling electrical connectivity between internal and external components.
3Volume of stationary object
If a compact package design is implemented, then device size is reduced, but space for mounting integrated circuits is limited
Solution Approach 1:
The available mounting space is extended into the third dimension by creating a recess in the backplate. This recess provides additional volume for mounting integrated circuits without increasing the planar footprint of the package, allowing compact packaging while accommodating sufficient space for electronic components.
4Ease of operation
If conductive traces traverse the seal to provide external connections, then electrical connectivity is achieved, but manufacturing complexity increases
Solution Approach 1:
The conductive traces are formed on the backplate before the sealing operation. This preliminary formation of traces simplifies the overall manufacturing process by establishing the electrical connection pathways in advance, allowing the seal to be applied over the traces without requiring subsequent complex routing or connection steps.
Data Source
AI summary
This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.