Mini LED Driving Backplate Signal Line Segmentation
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Solution Overview
Problem
In Mini LED backlight modules, the long driving lines and high number of control chips lead to increased driving time and reduced refreshing frequency in large-sized display devices, due to the extensive coupling of control chips via a single signal line, which also results in excessive current load and parasitic capacitance.
Innovation Solution
The driving backplate divides control chips into groups coupled to the same signal line, with signal lines connected in parallel, reducing the number of control chips per signal line and distributing the load evenly, thereby shortening driving time and enhancing refreshing frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If control chips are extensively coupled via a single signal line to cover large display areas, then the coverage area is improved, but the driving time increases and refreshing frequency decreases
Solution Approach 1:
The patent segments the control chips into multiple groups (first group and second group) that are coupled to different signal lines. Each signal line drives a subset of control chips rather than all chips through a single long line. This segmentation reduces the effective driving distance and time for each signal line while maintaining comprehensive coverage through parallel signal distribution.
2Area of stationary object
If control chips are extensively coupled via a single signal line, then the coverage area is improved, but the parasitic capacitance increases
Solution Approach 1:
By dividing control chips into multiple groups connected to different signal lines, the total capacitance load on each individual signal line is reduced. The parasitic capacitance is distributed across multiple shorter signal lines rather than concentrated on one extremely long line, reducing overall signal interference and improving signal integrity.
3Area of stationary object
If control chips are extensively coupled via a single signal line, then the coverage area is improved, but the current load becomes excessive
Solution Approach 1:
The patent divides the control chip array into multiple groups, each driven by separate signal lines. This segmentation distributes the total current load across multiple parallel signal lines, preventing any single line from carrying excessive current. The current demand is divided and managed in smaller, more manageable segments.
Solution Approach 2:
The patent transitions from a single-dimension serial coupling (one long signal line) to a multi-dimensional parallel coupling structure. Multiple signal lines are arranged in parallel, creating a two-dimensional signal distribution network that reduces the burden on each individual line while maintaining comprehensive chip coverage.
4Device complexity
If control chips are extensively coupled via a single signal line, then the device structure is simplified, but the refreshing frequency decreases
Solution Approach 1:
By segmenting control chips into multiple groups on different signal lines, the patent enables parallel driving operations. Multiple signal lines can update their respective control chip groups simultaneously, significantly increasing the overall refreshing frequency compared to sequential updating through a single long signal line.
Solution Approach 2:
The patent introduces a multi-dimensional parallel signal line architecture that allows simultaneous signal transmission to multiple control chip groups. This parallelism in the spatial arrangement of signal lines directly translates to higher refreshing frequencies by eliminating the sequential bottleneck of a single long signal line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the length of driving lines, prevents excessive current load, and minimizes parasitic capacitance, ensuring consistent brightness and improved performance of the display device by optimizing the layout and fabrication process.
Implementation Method 1
forming a first electrode layer over a buffer layer by a process of sputtering
Implementation Method 2
forming a first electrode layer over a buffer layer by a process of sputtering, coating, baking, photo-exposing, developing, hard baking, etching, and stripping
Data Source
AI summary
The disclosure provides a driving backplate and a display device. The driving backplate includes a substrate having a plurality of light source regions where light sources are disposed, the plurality of light source regions being arranged in an array; and a plurality of control chips arranged in an array on the substrate, the plurality of control chips being in one-to-one correspondence with the plurality of light source regions and each configured to provide a driving signal to the light source in a corresponding light source region, wherein each column of control chips is divided into at least two groups, each group of control chips are coupled in series through a same signal line, and the at least two groups of control chips are coupled in parallel with each other.