Backside Aperture Structures for Semiconductor Delamination Prevention
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Solution Overview
Problem
De-lamination in semiconductor devices due to trapped air pockets impairs heat dissipation, leading to operational hot spots and thermal runaway, which conventional techniques fail to entirely eliminate.
Innovation Solution
The introduction of aperture structures on the backside of semiconductor components, etched using techniques like laser or chemical etching, to create pathways for trapped gases to escape during the bonding process, optimizing aperture configurations such as single, orthogonal, multiple parallel, and matrix patterns to enhance venting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding techniques are used to attach component film to silicon wafer, then bonding process is simple and fast, but trapped air pockets cause de-lamination and thermal issues
Solution Approach 1:
The patent introduces aperture structures (porous features) on the backside of semiconductor components to enable trapped gases to escape during bonding. These apertures act as controlled porous pathways that allow de-gassing without compromising the bonding interface, thereby preventing de-lamination while maintaining bonding process simplicity
Solution Approach 2:
The bonding interface is segmented into two parts: the primary bonding surface (frontside) that maintains strong adhesion, and the backside aperture structures that provide gas escape pathways. This segmentation allows the bonding process to simultaneously achieve strong bonding and effective de-gassing
2Reliability
If aperture structures are added to component backside, then trapped gases can escape and de-lamination is reduced, but manufacturing process becomes more complex
Solution Approach 1:
The aperture structures are formed on the component backside before the bonding process. This preliminary action prepares the de-gassing pathways in advance, so that during bonding the trapped gases can escape through pre-formed apertures without requiring additional process steps or complex real-time control
Solution Approach 2:
The patent varies aperture parameters (size, shape, distribution, depth) to optimize de-gassing effectiveness while controlling manufacturing complexity. By adjusting these parameters, the apertures can be tailored to specific application requirements without fundamentally changing the manufacturing approach
3Productivity
If air pockets are trapped during bonding, then bonding process is straightforward, but heat dissipation is impaired leading to thermal runaway
Solution Approach 1:
The patent extracts trapped gases from the bonding interface by providing dedicated escape pathways (apertures) on the component backside. By removing the harmful air pockets during bonding, the thermal dissipation pathway is maintained, preventing hot spots and thermal runaway while keeping the bonding process efficient
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The aperture structures effectively reduce de-lamination by facilitating the removal of trapped gases, thereby improving thermal dissipation and reducing the risk of thermal runaway in semiconductor packages.
Implementation Method 1
The molding process utilized may also affect de-lamination reduction by enhancement of process pressures
Implementation Method 2
The introduction of aperture structures on the backside of semiconductor components, etched using techniques like laser or chemical etching
Implementation Method 3
etched using techniques like laser or chemical etching
Data Source
AI summary
A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase.