Backside Attack Detection via Substrate Resistance Monitoring
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Solution Overview
Problem
Conventional integrated circuits (ICs) lack sufficient protection mechanisms against backside security attacks, which can be invasive and compromise the security of the IC by modifying the substrate, making it vulnerable to data extraction.
Innovation Solution
A security device is integrated into the substrate with a first and second electrode and an electrical insulator, forming an electrical path that changes resistance when the substrate is modified, allowing for detection of backside security attacks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is made thinner to facilitate backside access, then attacker access is improved, but structural integrity and security detection capability worsen
Solution Approach 1:
Security detection circuits and deep trench isolation structures are integrated into the substrate during the manufacturing process, before any potential attacks occur. This preliminary integration ensures that detection capabilities are embedded throughout the substrate structure, maintaining integrity while enabling attack detection regardless of substrate thickness variations.
Solution Approach 2:
The substrate is designed with locally varied properties: deep trench isolation structures are strategically placed in specific regions where attack vectors are most likely, while other regions maintain standard substrate characteristics. This localized enhancement provides targeted security without compromising overall substrate integrity or requiring uniform thinning.
2Object-affected harmful factors
If deep trench isolation structures are added to block backside attacks, then backside attack resistance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The deep trench isolation structures are merged with the existing substrate fabrication process, combining security features with standard manufacturing steps. By integrating security structures into the baseline fabrication workflow rather than adding separate complex processes, the solution enhances backside protection while minimizing increases in device complexity and manufacturing difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The security device effectively detects backside security attacks by monitoring changes in electrical resistance, providing a mechanism to prevent data extraction and protect critical information stored in the IC.
Implementation Method 1
The electrical resistance of the electrical path changes when the substrate is modified to thereby detect the backside security attack
Data Source
AI summary
Security devices for protecting ICs from backside security attacks. A security device includes an N− well formed in a substrate, a P+ center disposed in the central region of the N− well, and a P+ ring surrounding the N− well. To prevent latchup, a pair of inner and outer N+ rings is formed in the N− well. When a current source is applied to the P+ center, the current flows through a portion of the substrate and is picked up by the P+ ring. When an attacker mills the substrate or makes a trench in the substrate, the resistance of the substrate changes. By monitoring the voltage difference between the P+ center and P+ ring, the attempt to attack the die can be detected.