Backside Chiplet Interface With Direct Interconnect for Low-Latency Mixing
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Solution Overview
Problem
As silicon chip manufacturing scales up, larger chips face lower yields due to manufacturing defects, making it economically advantageous to redesign larger chips into multiple smaller chips (chiplets) to improve yield and reduce costs. However, existing chiplet architectures often require communication to pass through a host die, creating bottlenecks in power and latency for inter-chiplet communication.
Innovation Solution
The implementation of backside interfaces for chiplet architecture mixing, which includes a host die interfacing with multiple chiplet areas and an interconnect directly coupling these chiplet areas, allowing for direct communication between chiplets without relying on the host die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If chiplets communicate through the host die, then communication coordination is simplified, but latency and power consumption increase
Solution Approach 1:
The patent segments the communication path by introducing a dedicated interconnect structure that directly couples chiplet areas, separating the coordination function (host die) from the data transmission path (direct interconnect). This allows simplified coordination to be maintained while enabling faster direct communication between chiplets.
Solution Approach 2:
The patent introduces a dedicated interconnect as an intermediary element that provides a direct communication channel between chiplet areas. This intermediary structure handles the high-speed data transmission independently, allowing the host die to focus on coordination while the interconnect handles latency-sensitive communication.
2Device complexity
If chiplets communicate through the host die, then communication routing is simplified, but power consumption increases
Solution Approach 1:
The communication system is segmented into two independent paths: a simplified routing path through the host die for coordination, and a dedicated low-power path through the direct interconnect for data transmission. This segmentation allows each path to be optimized for its specific function, reducing overall power consumption.
Solution Approach 2:
The dedicated interconnect acts as an intermediary that provides a low-power communication channel between chiplets. By handling data transmission independently of the host die, it reduces the power burden on the host die while maintaining simplified routing through the interconnect's direct coupling.
3Adaptability or versatility
If larger chips are manufactured, then integration is higher, but manufacturing yield decreases
Solution Approach 1:
The patent applies segmentation by dividing the large integrated system into multiple smaller chiplets that can be manufactured separately with higher yield. These chiplets are then combined through the backside interface and direct interconnect to achieve the desired high integration, thus resolving the contradiction between integration and manufacturing yield.
Data Source
AI summary
The disclosed semiconductor package includes a first chiplet area for receiving a first chiplet, a second chiplet area for receiving a second chiplet, and a host die coupled to the first and second chiplet areas. The semiconductor package also includes an interconnect directly coupling the first chiplet area to the second chiplet area. Various other methods, systems, and computer-readable media are also disclosed.