Backside-Contact Hybrid Cells for Dense Row-Based Chip Layouts
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Solution Overview
Problem
Existing chip layouts face challenges in achieving desired performance levels without excessive increases in power and area when swapping high-density cells with high-performance cells, due to disrupted row arrangements and routing issues.
Innovation Solution
Implementing hybrid high-performance cells with wider diffusion regions and a dual-portion structure, allowing partial swapping with high-density cells while maintaining row arrangements, and utilizing backside metal layers for power distribution to minimize layout disruptions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-density cells are swapped with high-performance cells to achieve desired performance levels, then circuit performance is improved, but power consumption and area increase excessively
Solution Approach 1:
The patent applies local quality by creating hybrid cells that combine high-performance transistors in specific locations (where performance is critical) with high-density transistors in other locations. This allows the chip to achieve desired performance levels in critical paths while maintaining low power consumption and small area in non-critical areas, thus resolving the contradiction between performance and power/area usage.
Solution Approach 2:
The patent segments the chip into different cell types (high-performance cells, high-density cells, and hybrid cells) that can be selectively placed in different locations. This segmentation allows optimization of performance, power, and area independently in different regions, preventing excessive power consumption and area increase while achieving target performance.
2Reliability
If high-density cells are swapped with high-performance cells, then circuit performance is improved, but chip area increases excessively
Solution Approach 1:
The patent uses local quality by placing high-performance transistors only where needed for critical performance requirements, while using compact high-density transistors in non-critical areas. The hybrid cells provide a middle ground with moderate performance and compact area, allowing the overall chip area to remain small while achieving target performance in critical paths.
Solution Approach 2:
The patent segments the chip layout into different cell types with different area characteristics. By strategically placing high-performance cells, high-density cells, and hybrid cells in different locations, the total chip area is optimized to avoid excessive area increase while maintaining required performance levels.
3Reliability
If high-density cells are swapped with high-performance cells, then circuit performance is improved, but row arrangements are disrupted and routing becomes complex
Solution Approach 1:
The patent creates hybrid cells that serve multiple functions: they provide high-performance characteristics when needed while maintaining compatibility with standard row-based cell placement and routing architectures. This multi-functionality allows performance improvement without disrupting existing row arrangements or significantly increasing routing complexity.
Solution Approach 2:
The patent applies partial action by implementing hybrid cells that partially combine features of high-performance and high-density cells. This partial implementation allows performance improvement in critical areas while maintaining compatibility with standard layout and routing practices, thus avoiding excessive layout complexity.
Data Source
AI summary
A chip includes a first cell and a second cell. The first cell includes a first diffusion region extending in a first direction, and a first backside contact coupled to a bottom surface of the first diffusion region. The second cell includes a second diffusion region extending in the first direction, wherein the second diffusion region is wider than the first diffusion region in a second direction perpendicular to the first direction, and a second backside contact coupled to a bottom surface of the second diffusion region. The chip also includes a power rail extending under the first cell and the second cell in the first direction, wherein the power rail is coupled to the first backside contact and the second backside contact.


