Semiconductor Backside Cooling Structure Using Low-Pressure Boiling
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Solution Overview
Problem
The semiconductor industry faces challenges in heat dissipation due to the limitations of existing cooling technologies, which hinder the integration density improvements and operational efficiency of semiconductor components.
Innovation Solution
A cooling structure comprising a housing with a liquid delivery device and a gas exhaust device that creates a cooling space adjacent to the semiconductor component, where a liquid coolant is delivered and the pressure is lowered to decrease the boiling temperature, allowing for efficient heat dissipation through vaporization of the coolant, thereby enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling technologies are used, then the cooling structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent utilizes phase transition of coolant from liquid to vapor state to enhance heat dissipation efficiency. The coolant absorbs heat from the semiconductor component during vaporization, providing superior cooling performance compared to conventional liquid cooling methods while managing the complexity through integrated design
Solution Approach 2:
The patent employs a two-phase coolant system with liquid delivery and vapor extraction mechanisms. The hydraulic delivery of liquid coolant combined with pneumatic extraction of vapor creates an efficient heat transfer cycle that addresses the heat dissipation challenge while maintaining manageable system complexity
2Quantity of substance
If integration density is increased, then more components are integrated into given area, but heat dissipation becomes more challenging
Solution Approach 1:
The two-phase coolant system leverages phase transition to provide intensive cooling capability that can handle the increased heat density from higher integration density. The vaporization process absorbs large amounts of heat efficiently, enabling the system to manage thermal loads from densely integrated components
Solution Approach 2:
The cooling structure is positioned adjacent to the semiconductor component with direct thermal coupling, providing localized cooling where it is most needed. This local quality approach ensures efficient heat removal from high-density integration areas without requiring system-wide cooling complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively absorbs heat from the semiconductor component by vaporizing the liquid coolant, improving heat dissipation efficiency and maintaining the semiconductor component at a suitable operation temperature.
Implementation Method 1
a liquid coolant is delivered and the pressure is lowered to decrease the boiling temperature, allowing for efficient heat dissipation through vaporization of the coolant
Implementation Method 2
The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing
Data Source
AI summary
An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.