Backside Diagonal Routing for Faster IC Signal and Power Delivery
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Solution Overview
Problem
Conventional layouts of metal conductors in integrated circuits do not efficiently route signals and power, leading to inefficiencies in signal and power distribution.
Innovation Solution
Implementing diagonal routing for metal conductors on the backside of integrated circuits, combining Manhattan and diagonal routing techniques to optimize signal and power delivery networks, utilizing backside metal layers for improved connectivity and reduced signal delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional Manhattan routing is used for metal conductors, then the routing layout is simple and easy to manufacture, but the signal transmission efficiency and power delivery speed are reduced
Solution Approach 1:
The patent introduces diagonal routing in addition to traditional Manhattan routing, adding a new dimensional approach to conductor layout. This allows signals to travel more directly between points by utilizing 45-degree angled paths, reducing the total path length and improving transmission efficiency while maintaining manufacturability through systematic routing rules
2Device complexity
If conventional Manhattan routing is used for metal conductors, then the routing structure is simple, but the power distribution network efficiency is reduced due to longer path lengths
Solution Approach 1:
By incorporating diagonal routing segments into the power distribution network, the patent enables more direct power delivery paths. This reduces the total length of power delivery networks and minimizes distribution delays, while the structured implementation keeps the overall system complexity manageable
3Productivity
If diagonal routing is implemented on backside metal layers, then signal transmission efficiency is enhanced and power delivery is optimized, but the routing complexity increases
Solution Approach 1:
The patent applies diagonal routing specifically to backside metal layers, utilizing the additional spatial dimension provided by the backside of the substrate. This allows efficient signal and power routing without interfering with frontside conventional routing, thereby improving productivity while managing complexity through spatial separation
Solution Approach 2:
The routing system is segmented into frontside Manhattan routing and backside diagonal routing. This segmentation allows each routing type to be optimized for its specific function and location, with the backside diagonal routing handling high-speed signals and power delivery while the frontside maintains conventional routing for other functions
Data Source
AI summary
An integrated circuit includes a device, a first interconnect structure disposed above the device and a second interconnect structure positioned below the device. The first interconnect structure includes multiple frontside metal layers. The second interconnect structure includes multiple backside metal layers, where each backside metal layer includes metal conductors routed according to diagonal routing. In some embodiments, a backside interconnect structure can include another backside metal layer that includes metal conductors routed according to mixed-Manhattan-diagonal routing. A variety of techniques can be used to route signals between metal conductors in the backside interconnect structure and cells on one or more frontside metal layers.