Backside Driver Layout for Borderless Display Panels
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Solution Overview
Problem
Existing display devices are not cost-effective and require sacrificing peripheral area for driver units, limiting their borderless design and visual effect when multiple units are connected.
Innovation Solution
The display device design places light-emitting units and driver units on opposite surfaces of the substrate, using conductive structures to connect them, allowing for a borderless design without needing space for the driver unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If driver units are placed on the same surface as light-emitting units, then electrical connection is simplified, but peripheral area is sacrificed and borderless design is limited
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional arrangement by placing driver units on the back surface of the substrate. This vertical separation in the Z-dimension allows the front surface to be fully utilized for light-emitting units without peripheral encroachment, achieving borderless display while maintaining electrical connectivity through conductive structures penetrating the substrate.
2Area of stationary object
If driver units are placed on the back surface of the substrate, then borderless design is achieved, but electrical connection becomes more complex
Solution Approach 1:
The patent segments the substrate into functionally distinct regions: the front surface for light-emitting units and the back surface for driver units. This spatial segmentation allows each surface to be optimized for its specific function while conductive structures provide the necessary interconnection, resolving the complexity issue through modular organization.
Solution Approach 2:
The patent introduces conductive structures as intermediary elements that penetrate the substrate to establish electrical connections between the front surface light-emitting units and the back surface driver units. This intermediary solution decouples the spatial separation benefit from the electrical connection complexity, allowing optimal placement while maintaining functional connectivity.
3Ease of manufacture
If conventional display device structure is used, then manufacturing is straightforward, but visual integrity when multiple units are connected is compromised
Solution Approach 1:
By moving driver units to the back surface, the patent eliminates front peripheral structures that would create visible borders when multiple display units are connected. This dimensional reorganization allows edge-to-edge display areas to meet seamlessly, achieving visual integrity while maintaining manufacturability through standard substrate processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves a borderless display device design that maintains visual integrity when multiple units are connected, improving display quality and reducing production costs.
Implementation Method 1
The conductive layer is disposed between the substrate and the chip
Implementation Method 2
The protection layer is disposed between the conductive layer and the chip
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a plurality of diodes, at least one transistor, a chip, a conductive layer and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The plurality of diodes are disposed on the first surface of the substrate. The at least one transistor is disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes. The chip is disposed on the second surface of the substrate and electrically connected to the at least one transistor. The conductive layer is disposed between the substrate and the chip. The protection layer is disposed between the conductive layer and the chip. Moreover, the protection layer has an opening and through which the chip is electrically connected to the conductive layer.