Backside Driver Display Layout for Narrow-Bezel Tiled Panels

The patent applies segmentation by dividing the electrical connection path into distinct segments: signal lines on the front surface, through-substrate conductors penetrating the substrate thickness, and driver connections on the back surface. This segmented approach manages the complexity of electrical connections across surfaces by creating modular connection points and intermediate conductive structures, making the overall system more manageable despite the three-dimensional arrangement

The patent introduces intermediary through-substrate conductors that act as mediators between the front surface pixel circuits and the back surface drivers. These intermediate conductive elements embedded within the substrate provide reliable electrical pathways, simplifying the overall connection architecture by creating dedicated interface points that bridge the two surfaces without requiring complex external routing

The patent applies preliminary action by forming the through-substrate conductors and connection portions during the substrate fabrication process itself, before the final assembly stages. This advance preparation ensures that the conductive pathways are precisely positioned and integrated into the substrate structure, reducing alignment requirements during subsequent manufacturing steps and lowering overall precision demands

The patent merges the formation of through-substrate conductors with the substrate manufacturing process, combining multiple functions into a single integrated structure. By integrating the electrical connection pathways directly into the substrate fabrication rather than adding them as separate post-processing steps, the patent reduces the number of alignment operations required and simplifies the manufacturing precision requirements