Backside Semiconductor Heat Pipe Cooling Without TIM Interfaces
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Solution Overview
Problem
Existing cooling systems for microelectronic devices suffer from high thermal resistance and inefficiency due to the design and manufacture of system components, leading to increased operating temperatures and reduced energy efficiency, particularly in high-power density chips.
Innovation Solution
An integrated cooling assembly is provided, comprising a semiconductor device with a heat pipe attached to its backside, utilizing a wick material within the heat pipe chamber and direct bonding or adhesive attachment to enhance heat transfer without intervening thermal interface materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface materials (TIMs) are used to facilitate heat transfer between chip and heat dissipation devices, then thermal coupling is enhanced, but system thermal resistance increases due to interfacial boundary regions and TIM material resistance
Solution Approach 1:
The patent removes the thermal interface material (TIM) layer from the heat transfer path by directly bonding the heat dissipation device to the chip substrate. This extraction eliminates the additional thermal resistance introduced by TIM materials and their interfacial boundary regions, while maintaining thermal coupling through direct mechanical and thermal contact between the chip and heat dissipation device.
2Device complexity
If passive cooling arrangements are used for heat dissipation, then device portability and simplicity are improved, but heat dissipation efficiency is limited by cumulative thermal resistance from multiple components
Solution Approach 1:
The patent merges the heat dissipation device directly with the chip substrate by eliminating intermediate components such as TIMs and heat spreaders. This consolidation reduces the number of thermal interfaces and cumulative thermal resistance in the heat transfer path, thereby improving heat dissipation efficiency while maintaining a simple passive cooling architecture suitable for portable devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cooling assembly reduces thermal resistance and enhances heat dissipation, allowing for more effective cooling of semiconductor devices by directly transferring heat from the device to the heat pipe, thereby improving energy efficiency and reducing operating temperatures.
Implementation Method 1
the inner surface of the heat pipe chamber includes a wick material, and the backside of the device is in contact with the wick material
Implementation Method 2
directly transferring heat from the device to the heat pipe
Implementation Method 3
heat pipe attached to its backside... utilizing a wick material within the heat pipe chamber
Data Source
AI summary
Embodiments herein provide for an integrated cooling assembly comprising a semiconductor device and a heat pipe attached to a backside of the semiconductor device. The heat pipe comprises a shell which defines a heat pipe chamber, the heat pipe shell having an inner surface and an outer surface, the inner surface of the heat pipe chamber includes a wick material, and the backside of the semiconductor device is in contact with the wick material.