Backside Interconnection Interface Die for Denser IC Packaging
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Solution Overview
Problem
The increasing demand for high-performance, high-capacity IC dies with lower costs and denser interconnects poses challenges due to power consumption and area occupancy by interconnect interfaces, limiting IC die size and increasing manufacturing complexity.
Innovation Solution
Relocating, partitioning, or decoupling the interconnection interface chiplet from the main IC die and high-bandwidth memory components, allowing for area expansion and vertical stacking to improve device density and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If interconnection interface chiplet is integrated on the main IC die, then device density and integration are improved, but area occupancy increases and manufacturing complexity increases
Solution Approach 1:
The interconnection interface functionality is segmented into a separate chiplet that can be independently designed, manufactured, and packaged. This segmentation allows the main IC die to focus on core computing functions while the interface chiplet handles communication protocols, thereby reducing area occupancy on the main die while maintaining high device density through modular integration.
Solution Approach 2:
The interconnection interface chiplet is extracted from the main IC die and placed on a separate substrate or package layer. This extraction eliminates the area constraints imposed by integrating all functions on a single die, allowing the main IC die to be optimized for computational density while the interface functions reside on a separate component that can be densely packed in the package.
2Adaptability or versatility
If interconnection interface chiplet is integrated on the main IC die, then device density is improved, but manufacturing complexity increases
Solution Approach 1:
By segmenting the interconnection interface into a separate chiplet, the manufacturing process is divided into independent stages: fabrication of the main IC die, fabrication of the interface chiplet, and subsequent packaging integration. This segmentation allows each component to be manufactured using optimized processes for its specific function, reducing overall manufacturing complexity compared to monolithic integration.
Solution Approach 2:
A package substrate or interposer acts as an intermediary between the main IC die and the interface chiplet, providing mechanical support, electrical interconnections, and thermal management. This intermediary simplifies the manufacturing process by decoupling the fabrication of the two components while enabling their integration through standardized packaging techniques.
3Area of stationary object
If interconnection interface chiplet is separated from main IC die, then area usage is optimized, but device-to-device interface complexity increases
Solution Approach 1:
The interface chiplet is extracted and placed on a separate package substrate, which provides a dedicated platform for implementing complex interconnection protocols. This extraction allows the main IC die to have simplified I/O interfaces while the package substrate handles the complexity of high-speed serial interfaces, differential signaling, and protocol encoding/decoding.
Solution Approach 2:
The package substrate serves as an intermediary that absorbs the interface complexity through features such as embedded decoupling capacitors, impedance-controlled traces, differential pair routing, and integrated voltage regulators. This intermediary shields the main IC die from the complexity of high-speed interface requirements while enabling area optimization on the die itself.
Data Source
AI summary
The technology relates to an integrated circuit (IC) package in which an interconnection interface chiplet and/or interconnection interface circuit are relocated, partitioned, and/or decoupled from a main or core IC die and/or high-bandwidth memory (HBM) components in an integrated component package.