Backside Conductive Layer Layout for IC Signal Detection

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Solution Overview

Problem

Backside conductive lines in integrated circuits can hinder signal detection during process failure analysis, emission microscopy, and electron beam inspection by blocking access to the substrate, limiting the effectiveness of these testing methods.

Innovation Solution

The implementation of specific layouts for backside metal layers that cover only select areas of the substrate, leaving exposed regions for testing, allowing for the detection of signals from the backside of the integrated circuit through the use of conductive segments and vias that route power and data signals while maintaining the integrity of the circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If backside conductive lines are implemented to transmit power signals, then power delivery is improved, but signal detection capability during testing is degraded

Engineering Contradiction:

Improvepower signal transmissionVSAvoidsignal detection during testing

Core Design Contradiction:

PowerVSDifficulty of detecting and measuring

Solution Approach 1:

The backside conductive layers are segmented into conductive segments that are strategically positioned to cover only specific areas of the substrate. This segmentation allows power signals to be transmitted through selected regions while leaving other regions exposed for testing purposes, thus resolving the contradiction between power delivery and signal detection capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the backside substrate are assigned different functions: some regions have conductive layers for power transmission, while other regions are left exposed for testing. This local differentiation allows simultaneous optimization of power delivery in covered areas and signal detection in exposed areas

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If backside conductive layers are added to transmit power signals, then circuit functionality is improved, but testing and analysis processes are hindered

Engineering Contradiction:

Improvecircuit functionalityVSAvoidtesting and analysis processes

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The conductive layers are divided into discrete segments that can be selectively placed on the backside substrate. This segmentation enables the circuit to gain enhanced functionality through additional power transmission paths while maintaining open areas that facilitate testing and analysis processes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive segments act as intermediaries that provide power transmission functionality without completely covering the substrate. By using segmented conductive structures rather than continuous layers, the patent enables both improved circuit functionality and maintained accessibility for testing

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11935830B2Integrated circuit with frontside and backside conductive layers and exposed backside substrate

Publication Date: 2024.03.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An integrated circuit includes multiple backside conductive layers disposed over a backside of a substrate. The multiple backside conductive layers each includes conductive segments. The conductive segments in at least one of the backside conductive layers are configured to transmit one or more power signals. The conductive segments of the multiple backside conductive layers cover select areas of the backside of the substrate, thereby leaving other areas of the backside of the substrate exposed.