Backside Matching Layer for Ultrasound Transducer Thermal Management
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Solution Overview
Problem
Conventional ultrasound transducers face limitations in thermal management, leading to patient discomfort due to maximum surface temperature constraints, and existing thermal management techniques primarily focus on the backside, necessitating improved thermal characteristics.
Innovation Solution
The design incorporates a piezoelectric element with a lens and a heat sink connected via a backside matching layer that conducts heat away from the piezoelectric element to the heat sink, utilizing multiple matching layers with varying acoustic impedances and thermal conductivities to enhance thermal dissipation and acoustic performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional impedance matching layers are used to increase energy transmission, then acoustic performance is improved, but lens temperature increases causing patient discomfort
Solution Approach 1:
The matching layer is divided into multiple discrete layers with different acoustic impedances. The first matching layer has acoustic impedance between 2-8 MRayl and the second matching layer has acoustic impedance between 5-15 MRayl, creating a gradient that improves energy transmission while managing thermal distribution
Solution Approach 2:
Different regions of the transducer are assigned different thermal management properties. The backside matching layer with thermal conductivity of 0.5-50 W/mK is specifically positioned to conduct heat away from the piezoelectric element, while the front matching layers focus on acoustic impedance matching for energy transmission
2Temperature
If thermal management techniques are applied to the backside of the transducer, then lens temperature is reduced, but acoustic performance may be compromised
Solution Approach 1:
The backside matching layer serves dual functions: it provides thermal management by conducting heat away from the piezoelectric element (thermal conductivity of 0.5-50 W/mK) and simultaneously provides acoustic impedance matching (acoustic impedance between 2-8 MRayl), eliminating the need to choose between thermal and acoustic performance
Solution Approach 2:
The backside matching layer acts as an intermediary between the piezoelectric element and the heat sink, facilitating both thermal energy transfer and acoustic wave management, thereby protecting the lens from overheating while maintaining acoustic performance
3Power
If maximum power transmission is used to improve imaging quality, then signal strength increases, but patient discomfort increases due to temperature constraints
Solution Approach 1:
The patent converts the harmful heat generated during high-power operation into a manageable thermal flow path. The backside matching layer with moderate thermal conductivity (0.5-50 W/mK) captures waste heat from the piezoelectric element and directs it to the heat sink, allowing higher transmit power without increasing patient discomfort
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains a cooler lens surface temperature, allowing for increased power transmission and improved acoustic properties, such as increased sensitivity and bandwidth, while maintaining comparable acoustic performance to conventional transducers.
Implementation Method 1
Piezoelectric element 108 can convert electrical signals into ultrasound waves to be transmitted toward a target and can also convert received ultrasound waves into electrical signals
Implementation Method 2
The backside matching layer is thermally connected to the piezoelectric element and the heat sink. The backside matching layer is configured to conduct heat from the piezoelectric element to the heat sink
Data Source
AI summary
Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer includes a piezoelectric element defining a front side and a back side. The ultrasound transducer includes a lens connected to the front side of the piezoelectric element, a heat sink connected to the back side of the piezoelectric element, and a backside matching layer disposed between the piezoelectric element and the heat sink. The backside matching layer is thermally connected to the piezoelectric element and the heat sink, and the backside matching layer is configured to conduct heat from the piezoelectric element to the heat sink.


