Backside PCB Power Delivery Cooling for Expansion Cards
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Solution Overview
Problem
The challenge of meeting power delivery and thermal requirements on expansion cards, such as graphics accelerator cards, is exacerbated by limited PCB real estate for voltage regulators, which restricts the power that can be delivered to integrated circuits.
Innovation Solution
Positioning power delivery components on the backside of a printed circuit board and employing a low-profile cooling system to cool these components, allowing for increased power delivery and reduced impedance, while fitting within industry-standard form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power delivery components are placed on the front side of the PCB, then PCB real estate is utilized, but power delivery capacity is limited due to space constraints
Solution Approach 1:
The patent applies dimensionality change by moving power delivery components from the traditional front side of the PCB to the back side, utilizing the third dimension (z-axis) of space. This allows both front and back sides of the PCB to be used for component placement, effectively doubling the available area for power delivery components and enabling higher power delivery capacity without increasing the PCB footprint.
2Power
If backside power delivery components are used, then power delivery capacity increases, but thermal management becomes more challenging
Solution Approach 1:
The patent introduces a thermal management intermediary system consisting of a thermal interface material and a heat sink positioned on the back side of the PCB. This intermediary structure captures heat from the power delivery components before it can affect the integrated circuit on the front side, enabling high power delivery capacity while maintaining proper thermal management through targeted heat extraction and dissipation.
3Temperature
If cooling systems are added to cool backside power delivery components, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling function with the existing PCB structure by integrating the heat sink directly onto the back side of the board, combining structural support and thermal management functions into a single integrated solution. This approach improves thermal management while minimizing the increase in device complexity by reusing and combining existing structural elements rather than adding separate, independent cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a 33% increase in power delivery to integrated circuits, reduces power path resistance and PDN impedance, and enhances power conversion efficiency, achieving higher throughput power and lower noise.
Implementation Method 1
a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board
Data Source
AI summary
The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.