Backside Optical Elements on PICs for Tolerant Fiber Coupling
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Solution Overview
Problem
There is a lack of a scalable, manufacturable, and pluggable optical fiber connector solution for photonic integrated circuits (PICs), which hinders the mass production of photonic devices.
Innovation Solution
Implementing optical elements on photonic integrated circuits (PICs) with a substrate that includes a waveguide structure and a set of optical elements on the opposite side, utilizing optical reflectors to reflect signals towards the optical elements, and incorporating metalenses or microlenses to enhance alignment tolerance and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fiber connectors are implemented for photonic integrated circuits, then optical signal transmission is enabled, but scalability and manufacturability are limited
Solution Approach 1:
The patent combines the optical fiber connector functionality directly with the photonic integrated circuit substrate, merging previously separate components (connector and PIC) into a unified structure. This integration enables mass production through standard semiconductor manufacturing processes while maintaining optical signal transmission capability, thereby resolving the contradiction between reliability and productivity.
2Reliability
If traditional optical fiber connectors are used, then optical connection is achieved, but alignment tolerance is insufficient for mass production
Solution Approach 1:
The patent introduces a vertical dimension to the alignment problem by implementing optical elements on the backside of the substrate. This dimensional change allows the optical path to be established through vertical stacking rather than lateral alignment, dramatically increasing alignment tolerance and enabling mass production while maintaining reliable optical connection.
3Device complexity
If optical elements are integrated on the same side as waveguides, then compact design is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the PIC into two functional sides: the front side contains waveguides and electronic circuits, while the backside contains optical elements such as metalenses. This segmentation allows each side to be optimized and manufactured independently using appropriate processes, then combined through substrate bonding, thereby reducing overall manufacturing complexity while achieving high integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides increased scalability, manufacturability, and alignment tolerance for optical fiber connectors, enabling efficient optical signal transmission and integration with electronic circuits.
Implementation Method 1
The optical reflector is configured reflect an optical signal received from the waveguide toward the set of optical elements
Implementation Method 2
when an optical signal traveling in a waveguide is incident on the boundary between the inner core and the outer cladding at an angle exceeding the critical angle, the optical signal can exhibit total internal reflection
Implementation Method 3
At the boundary, an evanescent wave can be generated from the optical signal. Generally, an evanescent wave is an oscillating wave (e.g., electromagnetic wave or acoustic wave) generated at a boundary between two media and exists only within a very short distance from the boundary. Evanescent waves can exit the waveguide, and their amplitude can decay exponentially as a function of distance from the boundary
Data Source
AI summary
A device includes a photonic integrated circuit (PIC) of a PIC structure. The PIC includes a substrate and a waveguide structure disposed on a first side of the substrate. The waveguide structure includes an optical reflector disposed on a waveguide. The device further includes a set of optical elements of the PIC structure. The set of optical elements is formed on a second side of the substrate opposite the first side of the substrate. The optical reflector is configured reflect an optical signal received from the waveguide toward the set of optical elements.