Backside Pixel Circuitry for Seamless LED Displays
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Solution Overview
Problem
Modular approaches to forming large displays using multiple smaller LCD and OLED units result in visible dark seams between panels, which detract from the viewing experience.
Innovation Solution
A display design where pixel circuits are mounted on the backside of a substrate, with self-emitting devices on the front surface connected via conductive vias through the substrate, allowing for seamless integration of panels by matching non-emitting spaces and eliminating seams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple smaller displays are combined to form a larger display, then the total display size is increased, but visible dark seams appear between panels
Solution Approach 1:
The patent inverts the conventional display structure by placing pixel circuits on the backside of the substrate rather than the front. This allows the front surface to have uniform light emission without circuit interruptions, enabling seamless panel integration when multiple displays are combined into a larger display system
Solution Approach 2:
The patent moves pixel circuits from the front surface (2D plane) to the backside of the substrate, utilizing the third dimension (depth/thickness) to resolve the conflict between circuit functionality and visual continuity. This spatial reconfiguration allows front surfaces to align perfectly without dark seams while maintaining full circuit functionality on the backside
2Ease of manufacture
If pixel circuits are placed on the front surface of the substrate, then electrical connection is simplified, but non-emitting spaces are visible and disrupt the display uniformity
Solution Approach 1:
The patent inverts the conventional arrangement by placing pixel circuits on the backside of the substrate instead of the front surface. This inversion allows the front surface to provide uniform light emission without circuit interruptions, while electrical connections are maintained through conductive vias that pass through the substrate to reach the circuits on the backside
3Ease of manufacture
If conventional display structures are used, then manufacturing is straightforward, but panel edges create visible seams when combined
Solution Approach 1:
The patent inverts the conventional display structure by placing all pixel circuits on the backside of the substrate. This allows panel edges to be positioned precisely without visible seams, as the front surface contains only uniform light-emitting areas. The circuits on the backside connect to the front surface through conductive vias, maintaining functionality while achieving seamless panel integration
Solution Approach 2:
The patent utilizes the third dimension by moving circuits from the front surface plane to the backside plane of the substrate. This spatial separation allows panel edges to align perfectly in the front view without visible seams, while electrical connections are established through the substrate thickness via conductive vias
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of large, seamless displays by ensuring that the combined length of non-emitting spaces between panels matches the length of the emitting spaces within them, reducing visual imperfections and enhancing the overall display quality.
Implementation Method 1
The self-emitting devices are electrically connected to the plurality of pixel circuits by at least one electrically conductive via traveling through the substrate
Data Source
AI summary
A display comprises a substrate (e.g., glass), a plurality of pixel circuits disposed on a back surface of the substrate, and a plurality of self-emitting devices disposed on a front surface of the substrate. The self-emitting devices are electrically connected to the plurality of pixel circuits by at least one electrically conductive via traveling through the substrate. Each pixel circuit comprises a first and a second transistor and a capacitor. The self-emitting devices may be LEDs or OLEDs for example.


